Caron; Alain

Patent Applications and Registrations

Patent applications and USPTO patent grants for Caron; Alain.The latest application filed is for "techniques for modular chip fabrication".

Company Profile

1.14.10

Caron; Alain - Montreal N/A CA
Caron; Alain - South Burlington VT US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and system for communicating message notifications to mobile devices Grant 9,408,240 - Caron , et al. August 2, 2	2016-08-02
Method for securely associating data with HTTP and HTTPS sessions Grant 9,088,416 - Grigoriev , et al. July 21, 2	2015-07-21
Method and system for instant messaging traffic routing Grant 8,812,597 - Le Bodic , et al. August 19, 2	2014-08-19
Techniques for modular chip fabrication Grant 8,629,562 - Caron , et al. January 14, 2	2014-01-14
Techniques for Modular Chip Fabrication App 20120326321 - Caron; Alain ; et al.	2012-12-27
Techniques for modular chip fabrication Grant 8,288,866 - Caron , et al. October 16, 2	2012-10-16
Techniques for Modular Chip Fabrication App 20110121456 - Caron; Alain ; et al.	2011-05-26
Techniques for modular chip fabrication Grant 7,892,885 - Caron , et al. February 22, 2	2011-02-22
Modular chip integration techniques Grant 7,741,153 - Caron , et al. June 22, 2	2010-06-22
Modular Chip Integration Techniques App 20090111215 - Caron; Alain ; et al.	2009-04-30
Techniques for Modular Chip Fabrication App 20090108427 - Caron; Alain ; et al.	2009-04-30
Method for Securely Associating Data with Http and Https Sessions App 20080307517 - Grigoriev; Nikolai ; et al.	2008-12-11
Method and System for Communicating Message Notifications to Mobile Devices App 20080263170 - Caron; Alain ; et al.	2008-10-23
Method and System for Instant Messaging Traffic Routing App 20080201441 - Bodic; Gwenael Le ; et al.	2008-08-21
Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid Grant 7,146,596 - Bednar , et al. December 5, 2	2006-12-05
Concurrent electrical signal wiring optimization for an electronic package Grant 7,017,128 - Audet , et al. March 21, 2	2006-03-21
Integrated Circuit Chip Having A Ringed Wiring Layer Interposed Between A Contact Layer And A Wiring Grid App 20050050505 - Bednar, Thomas R. ; et al.	2005-03-03
Concurrent electrical signal wiring optimization for an electronic package App 20040132229 - Audet, Jean ; et al.	2004-07-08
Concurrent electrical signal wiring optimization for an electronic package Grant 6,703,706 - Audet , et al. March 9, 2	2004-03-09
Concurrent electrical signal wiring optimization for an electronic package App 20030127728 - Audet, Jean ; et al.	2003-07-10

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