Carmona; Manuel

Patent Applications and Registrations

Patent applications and USPTO patent grants for Carmona; Manuel.The latest application filed is for "semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same".

Company Profile

0.5.8

Carmona; Manuel - Barcelona ES
Carmona; Manuel - Munich DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same Grant 7,781,900 - Carmona , et al. August 24, 2	2010-08-24
Microswitch with a first actuated portion and a second contact portion Grant 7,745,747 - Carmona , et al. June 29, 2	2010-06-29
Semiconductor Device Comprising a Housing and a Semiconductor Chip Partly Embedded in a Plastic Housing Composition, and Method for Producing the Same App 20080111231 - Carmona; Manuel ; et al.	2008-05-15
Method for mounting a chip on a base and arrangement produced by this method Grant 7,368,322 - Reiss , et al. May 6, 2	2008-05-06
Wafer-level MEMS package and manufacturing method thereof App 20080079142 - Carmona; Manuel ; et al.	2008-04-03
Microswitch with a first actuated portion and a second contact portion App 20080011593 - Carmona; Manuel ; et al.	2008-01-17
Substrate-based housing component with a semiconductor chip Grant 7,256,070 - Reiss , et al. August 14, 2	2007-08-14
Heat sink for surface-mounted semiconductor devices Grant 7,230,831 - Luckner , et al. June 12, 2	2007-06-12
Heat sink for surface-mounted semiconductor devices App 20060158857 - Luckner; Uwe ; et al.	2006-07-20
Substrate-based housing component with a semiconductor chip App 20060049503 - Reiss; Martin ; et al.	2006-03-09
Method for mounting a chip on a base and arrangement produced by this method App 20060017156 - Reiss; Martin ; et al.	2006-01-26
Substrate-based die package with BGA or BGA-like components App 20050285247 - Reiss, Martin ; et al.	2005-12-29
Arrangement for increasing the reliability of substrate-based BGA packages App 20050285266 - Reiss, Martin ; et al.	2005-12-29

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