Patent applications and USPTO patent grants for Carey; Dan.The latest application filed is for "wafer level fan-out with electromagnetic shielding".
Patent | Date |
---|---|
Wafer level fan-out with electromagnetic shielding Grant 10,103,106 - Dang , et al. October 16, 2 | 2018-10-16 |
Wafer Level Fan-out With Electromagnetic Shielding App 20170133326 - Dang; Thong ;   et al. | 2017-05-11 |
Methods of forming a microshield on standard QFN package Grant 9,627,230 - Carey , et al. April 18, 2 | 2017-04-18 |
Wafer level fan-out with electromagnetic shielding Grant 9,570,406 - Dang , et al. February 14, 2 | 2017-02-14 |
Wafer Level Fan-out With Electromagnetic Shielding App 20160351509 - Dang; Thong ;   et al. | 2016-12-01 |
Compartmentalized shielding of selected components Grant 9,137,934 - Morris , et al. September 15, 2 | 2015-09-15 |
Process for manufacturing a module Grant 8,359,739 - Carey , et al. January 29, 2 | 2013-01-29 |
Method for forming an electronic module having backside seal Grant 8,296,938 - Carey , et al. October 30, 2 | 2012-10-30 |
Microshield On Standard Qfn Package App 20120218729 - Carey; Dan ;   et al. | 2012-08-30 |
Compartmentalized Shielding Of Selected Components App 20120044653 - Morris; Thomas Scott ;   et al. | 2012-02-23 |
Method of manufacturing a module Grant 8,061,012 - Carey , et al. November 22, 2 | 2011-11-22 |
Backside Seal For Conformal Shielding Process App 20110038136 - Carey; Dan ;   et al. | 2011-02-17 |
Moisture protection metal enclosure Grant 7,772,682 - Zhang , et al. August 10, 2 | 2010-08-10 |
Bottom Side Support Structure For Conformal Shielding Process App 20090002971 - Carey; Dan ;   et al. | 2009-01-01 |
Backside Seal For Conformal Shielding Process App 20090002972 - Carey; Dan ;   et al. | 2009-01-01 |
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