| Patent | Date |
|---|
Showerhead With Interlaced Gas Feed And Removal And Methods Of Use
App 20220051910 - Bera; Kallol ; et al. | 2022-02-17 |
Modular Microwave Source With Multiple Metal Housings
App 20210391149 - Kraus; Philip Allan ; et al. | 2021-12-16 |
Showerhead with interlaced gas feed and removal and methods of use
Grant 11,189,502 - Bera , et al. November 30, 2 | 2021-11-30 |
Modular Microwave Source With Embedded Ground Surface
App 20210313153 - AuBuchon; Joseph F. ; et al. | 2021-10-07 |
Modular microwave source with embedded ground surface
Grant 11,049,694 - AuBuchon , et al. June 29, 2 | 2021-06-29 |
Monolithic Modular Microwave Source With Integrated Process Gas Distribution
App 20210098231 - Carducci; James ; et al. | 2021-04-01 |
Modular Microwave Source With Embedded Ground Surface
App 20210098236 - AuBuchon; Joseph F. ; et al. | 2021-04-01 |
Monolithic Modular Microwave Source With Integrated Temperature Control
App 20210100076 - Carducci; James ; et al. | 2021-04-01 |
Showerhead With Interlaced Gas Feed And Removal And Methods Of Use
App 20190311920 - Bera; Kallol ; et al. | 2019-10-10 |
Motorcycle
Grant D690,237 - Carducci , et al. September 24, 2 | 2013-09-24 |
Motorcycle
Grant D687,351 - Carducci , et al. August 6, 2 | 2013-08-06 |
Plasma process uniformity across a wafer by controlling a variable frequency coupled to a harmonic resonator
Grant 8,080,479 - Collins , et al. December 20, 2 | 2011-12-20 |
Plasma process uniformity across a wafer by controlling RF phase between opposing electrodes
Grant 8,076,247 - Collins , et al. December 13, 2 | 2011-12-13 |
Method of processing a workpiece in a plasma reactor with variable height ground return path to control plasma ion density uniformity
Grant 7,968,469 - Collins , et al. June 28, 2 | 2011-06-28 |
Plasma process uniformity across a wafer by apportioning ground return path impedances among plural VHF sources
Grant 7,884,025 - Collins , et al. February 8, 2 | 2011-02-08 |
Improving plasma process uniformity across a wafer by apportioning power among plural VHF sources
Grant 7,879,731 - Collins , et al. February 1, 2 | 2011-02-01 |
Method of plasma confinement for enhancing magnetic control of plasma radial distribution
Grant 7,780,866 - Miller , et al. August 24, 2 | 2010-08-24 |
Plasma Reactor With Wide Process Window Employing Plural Vhf Sources
App 20080179011 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Method Of Processing A Workpiece In A Plasma Reactor With Variable Height Ground Return Path To Control Plasma Ion Density Uniformity
App 20080179181 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Reactor With Ion Distribution Uniformity Controller Employing Plural Vhf Sources
App 20080178803 - COLLINS; KENNETH S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Controlling Rf Phase Between Opposing Electrodes
App 20080180028 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Apportioning Ground Return Path Impedances Among Plural Vhf Sources
App 20080182417 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Controlling A Variable Frequency Coupled To A Harmonic Resonator
App 20080182418 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Process Uniformity Across A Wafer By Apportioning Power Among Plural Vhf Sources
App 20080182416 - Collins; Kenneth S. ; et al. | 2008-07-31 |
Plasma Confinement Baffle And Flow Equalizer For Enhanced Magnetic Control Of Plasma Radial Distribution
App 20080110567 - Miller; Matthew L. ; et al. | 2008-05-15 |
Method Of Plasma Confinement For Enhancing Magnetic Control Of Plasma Radial Distribution
App 20080110860 - Miller; Matthew L. ; et al. | 2008-05-15 |
Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
Grant 7,196,283 - Buchberger, Jr. , et al. March 27, 2 | 2007-03-27 |
Plasma reactor overhead source power electrode with low arcing tendency, cylindrical gas outlets and shaped surface
App 20050178748 - Buchberger, Douglas A. JR. ; et al. | 2005-08-18 |
Thin film processing plasma reactor chamber with radially upward sloping ceiling for promoting radially outward diffusion
Grant 6,076,482 - Ding , et al. June 20, 2 | 2000-06-20 |
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