Carbonell; Laure Elisa
Patent Applications and Registrations
Patent applications and USPTO patent grants for Carbonell; Laure Elisa.The latest application filed is for "method for manufacturing germanide interconnect structures and corresponding interconnect structures".
- Carbonell; Laure Elisa - Leuven BE
- Carbonell; Laure Elisa - Montlhery FR
| Patent | Date |
|---|---|
| Method for manufacturing germamde interconnect structures and corresponding interconnect structures Grant 9,997,458 - Carbonell , et al. June 12, 2 | 2018-06-12 |
| Method for Manufacturing Germanide Interconnect Structures and Corresponding Interconnect Structures App 20150130062 - Carbonell; Laure Elisa ; et al. | 2015-05-14 |
| Formation of deep via airgaps for three dimensional wafer to wafer interconnect Grant 7,338,896 - Vanhaelemeersch , et al. March 4, 2 | 2008-03-04 |
| Formation of deep via airgaps for three dimensional wafer to wafer interconnect App 20060223301 - Vanhaelemeersch; Serge ; et al. | 2006-10-05 |
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