Cao; Zhitao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cao; Zhitao.The latest application filed is for "high density 3d interconnect configuration".

Company Profile

3.6.8

Cao; Zhitao - Campbell CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Density 3D Interconnect Configuration App 20220285273 - Dabral; Sanjay ; et al.	2022-09-08
High density 3D interconnect configuration Grant 11,309,246 - Dabral , et al. April 19, 2	2022-04-19
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Integration App 20220102280 - Dabral; Sanjay ; et al.	2022-03-31
High Density 3d Interconnect Configuration App 20210242170 - Dabral; Sanjay ; et al.	2021-08-05
Integrated Magnetic Passive Devices Using Magnetic Film App 20190051449 - Cappabianca; David P. ; et al.	2019-02-14
Apparatus for high compressive stress film deposition to improve kit life Grant 10,115,573 - Wei , et al. October 30, 2	2018-10-30
Integrated magnetic passive devices using magnetic film Grant 10,102,962 - Cappabianca , et al. October 16, 2	2018-10-16
Methods and apparatus for nodule control in a titanium-tungsten target Grant 9,960,023 - Wei , et al. May 1, 2	2018-05-01
Methods And Apparatus For Nodule Control In A Titanium-tungsten Target App 20160189941 - Wei; Junqi ; et al.	2016-06-30
Apparatus For High Compressive Stress Film Deposition To Improve Kit Life App 20160104603 - WEI; JUNQI ; et al.	2016-04-14
Methods for depositing materials in high aspect ratio features Grant 8,835,308 - Cao September 16, 2	2014-09-16
Methods For Depositing Materials In High Aspect Ratio Features App 20120156872 - CAO; ZHITAO	2012-06-21
Methods For Forming Low Moisture Dielectric Films App 20120058281 - Hua; Zhong Qiang ; et al.	2012-03-08

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