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Patent applications and USPTO patent grants for Canete; Baltazar.The latest application filed is for "re-routable clip for leadframe based product".
Patent | Date |
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Thermal enhancement of exposed die-down package Grant 10,764,989 - Lui , et al. Sep | 2020-09-01 |
Re-Routable Clip for Leadframe Based Product App 20190259689 - Lui; Tung Ching ;   et al. | 2019-08-22 |
Embedded Heat Slug to Enhance Substrate Thermal Conductivity App 20140355215 - Canete; Baltazar ;   et al. | 2014-12-04 |
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