Campbell; William Jarrett

Patent Applications and Registrations

Patent applications and USPTO patent grants for Campbell; William Jarrett.The latest application filed is for "run-to-run control method for proportional-integral-derivative (pid) controller tuning for rapid thermal processing (rtp)".

Company Profile

0.11.4

Campbell; William Jarrett - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters Grant 6,856,849 - Riley , et al. February 15, 2	2005-02-15
Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace Grant 6,850,322 - Campbell , et al. February 1, 2	2005-02-01
Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP) Grant 6,819,963 - Riley , et al. November 16, 2	2004-11-16
Method and apparatus for run-to-run control of deposition process Grant 6,650,957 - Campbell , et al. November 18, 2	2003-11-18
Method and apparatus for running metrology standard wafer routes for cross-fab metrology calibration Grant 6,484,064 - Campbell November 19, 2	2002-11-19
Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP) App 20020107604 - Riley, Terrence J. ; et al.	2002-08-08
Method for adjusting rapid thermal processing (RTP) recipe setpoints based on wafer electrical test (WET) parameters App 20020095278 - Riley, Terrence J. ; et al.	2002-07-18
Method and apparatus for controlling wafer thickness uniformity in a multi-zone vertical furnace App 20020085212 - Campbell, William Jarrett ; et al.	2002-07-04
Method for varying nitride strip makeup process based on field oxide loss and defect count Grant 6,376,261 - Campbell April 23, 2	2002-04-23
Method and apparatus for automatic routing for reentrant process Grant 6,360,133 - Campbell , et al. March 19, 2	2002-03-19
Method of controlling feature dimensions based upon etch chemistry concentrations Grant 6,352,867 - Couteau , et al. March 5, 2	2002-03-05
System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control Grant 6,230,069 - Campbell , et al. May 8, 2	2001-05-08
Method for determining a polishing recipe based upon the measured pre-polish thickness of a process layer App 20010000773 - Campbell, William Jarrett ; et al.	2001-05-03
Method for characterizing polish pad lots to eliminate or reduce tool requalification after changing a polishing pad Grant 6,217,412 - Campbell , et al. April 17, 2	2001-04-17
Method for providing cooperative run-to-run control for multi-product and multi-process semiconductor fabrication Grant 6,197,604 - Miller , et al. March 6, 2	2001-03-06

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