loadpatents
Patent applications and USPTO patent grants for Camenforte; Raymundo M..The latest application filed is for "die stitching and harvesting of arrayed structures".
Patent | Date |
---|---|
Wafer-level passive array packaging Grant 11,395,408 - Morrison , et al. July 19, 2 | 2022-07-19 |
Die Stitching And Harvesting Of Arrayed Structures App 20220199517 - Dabral; Sanjay ;   et al. | 2022-06-23 |
Flexible Package Architecture Concept in Fanout App 20220157680 - Shanmugam; Karthik ;   et al. | 2022-05-19 |
Wafer-Level Passive Array Packaging App 20220071013 - Morrison; Scott D. ;   et al. | 2022-03-03 |
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Grant 8,815,642 - West , et al. August 26, 2 | 2014-08-26 |
Laser-Assisted Cleaving of a Reconstituted Wafer for Stacked Die Assemblies App 20140038359 - West; Jeffrey Alan ;   et al. | 2014-02-06 |
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Grant 8,575,758 - West , et al. November 5, 2 | 2013-11-05 |
Laser-assisted Cleaving Of A Reconstituted Wafer For Stacked Die Assemblies App 20130032946 - WEST; JEFFREY ALAN ;   et al. | 2013-02-07 |
Testing of BGA and other CSP packages using probing techniques Grant 6,791,346 - Mehta , et al. September 14, 2 | 2004-09-14 |
Single unit automated assembly of flex enhanced ball grid array packages Grant 6,759,752 - Camenforte , et al. July 6, 2 | 2004-07-06 |
Super thin/super thermal ball grid array package Grant 6,744,125 - Camenforte , et al. June 1, 2 | 2004-06-01 |
Molded stiffener for flexible circuit molding Grant 6,617,525 - Briar , et al. September 9, 2 | 2003-09-09 |
Single unit automated assembly of flex enhanced ball grid array packages App 20030151148 - Camenforte, Raymundo M. ;   et al. | 2003-08-14 |
Super thin/super thermal ball grid array package App 20030143777 - Camenforte, Raymundo M. ;   et al. | 2003-07-31 |
Single unit automated assembly of flex enhanced ball grid array packages Grant 6,544,812 - Camenforte , et al. April 8, 2 | 2003-04-08 |
Super thin/super thermal ball grid array package Grant 6,537,848 - Camenforte , et al. March 25, 2 | 2003-03-25 |
Super thin/super thermal ball grid array package App 20020180040 - Camenforte, Raymundo M. ;   et al. | 2002-12-05 |
Testing of BGA and other CSP packages using probing techniques App 20020125909 - Mehta, Rajiv ;   et al. | 2002-09-12 |
Testing of BGA and other CSP packages using probing techniques App 20020125908 - Mehta, Rajiv ;   et al. | 2002-09-12 |
Molded stiffener for flexible circuit molding App 20020056570 - Briar, John ;   et al. | 2002-05-16 |
Method of molding flexible circuit with molded stiffener Grant 6,355,199 - Briar , et al. March 12, 2 | 2002-03-12 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.