Camenforte; Raymundo M.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Camenforte; Raymundo M..The latest application filed is for "die stitching and harvesting of arrayed structures".

Company Profile

0.11.12

Camenforte; Raymundo M. - San Jose CA
Camenforte; Raymundo M. - Allen TX
Camenforte; Raymundo M. - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wafer-level passive array packaging Grant 11,395,408 - Morrison , et al. July 19, 2	2022-07-19
Die Stitching And Harvesting Of Arrayed Structures App 20220199517 - Dabral; Sanjay ; et al.	2022-06-23
Flexible Package Architecture Concept in Fanout App 20220157680 - Shanmugam; Karthik ; et al.	2022-05-19
Wafer-Level Passive Array Packaging App 20220071013 - Morrison; Scott D. ; et al.	2022-03-03
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Grant 8,815,642 - West , et al. August 26, 2	2014-08-26
Laser-Assisted Cleaving of a Reconstituted Wafer for Stacked Die Assemblies App 20140038359 - West; Jeffrey Alan ; et al.	2014-02-06
Laser-assisted cleaving of a reconstituted wafer for stacked die assemblies Grant 8,575,758 - West , et al. November 5, 2	2013-11-05
Laser-assisted Cleaving Of A Reconstituted Wafer For Stacked Die Assemblies App 20130032946 - WEST; JEFFREY ALAN ; et al.	2013-02-07
Testing of BGA and other CSP packages using probing techniques Grant 6,791,346 - Mehta , et al. September 14, 2	2004-09-14
Single unit automated assembly of flex enhanced ball grid array packages Grant 6,759,752 - Camenforte , et al. July 6, 2	2004-07-06
Super thin/super thermal ball grid array package Grant 6,744,125 - Camenforte , et al. June 1, 2	2004-06-01
Molded stiffener for flexible circuit molding Grant 6,617,525 - Briar , et al. September 9, 2	2003-09-09
Single unit automated assembly of flex enhanced ball grid array packages App 20030151148 - Camenforte, Raymundo M. ; et al.	2003-08-14
Super thin/super thermal ball grid array package App 20030143777 - Camenforte, Raymundo M. ; et al.	2003-07-31
Single unit automated assembly of flex enhanced ball grid array packages Grant 6,544,812 - Camenforte , et al. April 8, 2	2003-04-08
Super thin/super thermal ball grid array package Grant 6,537,848 - Camenforte , et al. March 25, 2	2003-03-25
Super thin/super thermal ball grid array package App 20020180040 - Camenforte, Raymundo M. ; et al.	2002-12-05
Testing of BGA and other CSP packages using probing techniques App 20020125909 - Mehta, Rajiv ; et al.	2002-09-12
Testing of BGA and other CSP packages using probing techniques App 20020125908 - Mehta, Rajiv ; et al.	2002-09-12
Molded stiffener for flexible circuit molding App 20020056570 - Briar, John ; et al.	2002-05-16
Method of molding flexible circuit with molded stiffener Grant 6,355,199 - Briar , et al. March 12, 2	2002-03-12

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