CALO; Paul Armand Asentista

Patent Applications and Registrations

Patent applications and USPTO patent grants for CALO; Paul Armand Asentista.The latest application filed is for "method for connecting an electrical device to a bottom unit by using a solderless joint".

Company Profile

4.3.7

CALO; Paul Armand Asentista - Villach AT
Calo; Paul Armand Asentista - Melaka MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method For Connecting An Electrical Device To A Bottom Unit By Using A Solderless Joint App 20220278085 - CHIANG; Chau Fatt ; et al.	2022-09-01
Electrical interconnect structure with radial spokes for improved solder void control Grant 11,355,429 - Calo , et al. June 7, 2	2022-06-07
Stacked Transistor Chip Package With Source Coupling App 20220122906 - YUFEREV; Sergey ; et al.	2022-04-21
Pressure sensor having a lidless/laminate structure Grant 11,274,984 - Chiang , et al. March 15, 2	2022-03-15
Chip with Chip Pad and Associated Solder Flux Outgassing Trench App 20220068851 - Stadler; Michael ; et al.	2022-03-03
Power semiconductor package and method for fabricating a power semiconductor package Grant 11,211,356 - Lim , et al. December 28, 2	2021-12-28
Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control App 20210233839 - Calo; Paul Armand Asentista ; et al.	2021-07-29
Power Semiconductor Package and Method for Fabricating a Power Semiconductor Package App 20210057375 - Lim; Wee Aun Jason ; et al.	2021-02-25
Pressure Sensor App 20210025774 - Chiang; Chau Fatt ; et al.	2021-01-28
Leadframe, Semiconductor Package and Method App 20200051898 - Chiang; Chau Fatt ; et al.	2020-02-13

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