loadpatents
name:-0.0080618858337402
name:-0.0095348358154297
name:-0.0015671253204346
Calo; Paul Armand Patent Filings

Calo; Paul Armand

Patent Applications and Registrations

Patent applications and USPTO patent grants for Calo; Paul Armand.The latest application filed is for "semiconductor die package and method for making the same".

Company Profile
1.8.6
  • Calo; Paul Armand - Melaka MY
  • Calo; Paul Armand - Cebu N/A PH
  • Calo; Paul Armand - Cebu City PH
  • Calo; Paul Armand - Lapu-Lapu PH
  • Calo; Paul Armand - Lapu-Lapu City PH
  • Calo; Paul Armand - Iapu-Lapu City PH
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device including a solder barrier
Grant 9,640,459 - Tay , et al. May 2, 2
2017-05-02
Semiconductor die package and method for making the same
Grant 8,497,164 - Jereza , et al. July 30, 2
2013-07-30
Semiconductor Die Package And Method For Making The Same
App 20120329214 - Jereza; Armand Vincent C. ;   et al.
2012-12-27
Semiconductor die package and method for making the same
Grant 8,222,718 - Jereza , et al. July 17, 2
2012-07-17
Method for connecting a die attach pad to a lead frame and product thereof
Grant 8,110,492 - Almagro , et al. February 7, 2
2012-02-07
Method For Connecting A Die Attach Pad To A Lead Frame And Product Thereof
App 20100304534 - Almagro; Erwin Ian V. ;   et al.
2010-12-02
Method for connecting a die attach pad to a lead frame and product thereof
Grant 7,800,207 - Almagro , et al. September 21, 2
2010-09-21
Semiconductor Die Package And Method For Making The Same
App 20100193921 - Jereza; Armand Vincent C. ;   et al.
2010-08-05
Wireless semiconductor package for efficient heat dissipation
Grant 7,586,179 - Calo , et al. September 8, 2
2009-09-08
Method For Connecting A Die Attach Pad To A Lead Frame And Product Thereof
App 20090102031 - Almagro; Erwin Ian V. ;   et al.
2009-04-23
Wireless Semiconductor Package For Efficient Heat Dissipation
App 20090091010 - Calo; Paul Armand ;   et al.
2009-04-09
Folded frame carrier for MOSFET BGA
Grant 7,402,462 - Madrid , et al. July 22, 2
2008-07-22
Folded frame carrier for MOSFET BGA
App 20070015316 - Madrid; Ruben P. ;   et al.
2007-01-18

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