loadpatents
Patent applications and USPTO patent grants for Calo; Paul Armand.The latest application filed is for "semiconductor die package and method for making the same".
Patent | Date |
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Semiconductor device including a solder barrier Grant 9,640,459 - Tay , et al. May 2, 2 | 2017-05-02 |
Semiconductor die package and method for making the same Grant 8,497,164 - Jereza , et al. July 30, 2 | 2013-07-30 |
Semiconductor Die Package And Method For Making The Same App 20120329214 - Jereza; Armand Vincent C. ;   et al. | 2012-12-27 |
Semiconductor die package and method for making the same Grant 8,222,718 - Jereza , et al. July 17, 2 | 2012-07-17 |
Method for connecting a die attach pad to a lead frame and product thereof Grant 8,110,492 - Almagro , et al. February 7, 2 | 2012-02-07 |
Method For Connecting A Die Attach Pad To A Lead Frame And Product Thereof App 20100304534 - Almagro; Erwin Ian V. ;   et al. | 2010-12-02 |
Method for connecting a die attach pad to a lead frame and product thereof Grant 7,800,207 - Almagro , et al. September 21, 2 | 2010-09-21 |
Semiconductor Die Package And Method For Making The Same App 20100193921 - Jereza; Armand Vincent C. ;   et al. | 2010-08-05 |
Wireless semiconductor package for efficient heat dissipation Grant 7,586,179 - Calo , et al. September 8, 2 | 2009-09-08 |
Method For Connecting A Die Attach Pad To A Lead Frame And Product Thereof App 20090102031 - Almagro; Erwin Ian V. ;   et al. | 2009-04-23 |
Wireless Semiconductor Package For Efficient Heat Dissipation App 20090091010 - Calo; Paul Armand ;   et al. | 2009-04-09 |
Folded frame carrier for MOSFET BGA Grant 7,402,462 - Madrid , et al. July 22, 2 | 2008-07-22 |
Folded frame carrier for MOSFET BGA App 20070015316 - Madrid; Ruben P. ;   et al. | 2007-01-18 |
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