Calmidi; Varaprasad V.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Calmidi; Varaprasad V..The latest application filed is for "thermal substrate".

Company Profile

0.13.12

Calmidi; Varaprasad V. - Binghamton NY
Calmidi; Varaprasad V. - Vestal NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermal Substrate App 20130025839 - Egitto; Frank ; et al.	2013-01-31
Flexible circuit electronic package with standoffs Grant 7,851,906 - Alcoe , et al. December 14, 2	2010-12-14
Adjustable thickness thermal interposer and electronic package utilizing same Grant 7,629,684 - Alcoe , et al. December 8, 2	2009-12-08
Method of making wirebond electronic package with enhanced chip pad design Grant 7,510,912 - Caletka , et al. March 31, 2	2009-03-31
Method of inspecting articles using imaging inspection apparatus with directional cooling Grant 7,510,324 - Bhatt , et al. March 31, 2	2009-03-31
Method of making an imaging inspection apparatus with improved cooling Grant 7,490,984 - Bhatt , et al. February 17, 2	2009-02-17
Flexible circuit electronic package with standoffs App 20080237840 - Alcoe; David J. ; et al.	2008-10-02
Method of inspecting articles using imaging inspection apparatus with directional cooling App 20080170670 - Bhatt; Ashwinkumar C. ; et al.	2008-07-17
Method of making an imaging inspection apparatus with improved cooling App 20080144768 - Bhatt; Ashwinkumar C. ; et al.	2008-06-19
Imaging inspection apparatus with improved cooling Grant 7,354,197 - Bhatt , et al. April 8, 2	2008-04-08
Method of making wirebond electronic package with enhanced chip pad design App 20070254408 - Caletka; David V. ; et al.	2007-11-01
Adjustable thickness thermal interposer and electronic package utilizing same App 20070230130 - Alcoe; David J. ; et al.	2007-10-04
Imaging inspection apparatus with directional cooling Grant 7,261,466 - Bhatt , et al. August 28, 2	2007-08-28
Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same Grant 7,253,518 - Caletka , et al. August 7, 2	2007-08-07
Thermally enhanced lid for multichip modules Grant 7,186,590 - Alcoe , et al. March 6, 2	2007-03-06
Electronic package with thermally-enhanced lid Grant 7,183,642 - Bhattacharya , et al. February 27, 2	2007-02-27
Imaging inspection apparatus with directional cooling App 20070009084 - Bhatt; Ashwinkumar C. ; et al.	2007-01-11
Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same App 20060284304 - Caletka; David V. ; et al.	2006-12-21
Imaging inspection apparatus with improved cooling App 20060274891 - Bhatt; Ashwinkumar C. ; et al.	2006-12-07
Thermally enhanced lid for multichip modules App 20040057214 - Alcoe, David J. ; et al.	2004-03-25
Electronic package with thermally-enhanced lid App 20040046249 - Bhattacharya, Anandaroop ; et al.	2004-03-11
Liquid metal thermal interface for an electronic module Grant 6,665,186 - Calmidi , et al. December 16, 2	2003-12-16
Thermally enhanced lid for multichip modules Grant 6,665,187 - Alcoe , et al. December 16, 2	2003-12-16
Heat sink structure with pyramidic and base-plate cut-outs Grant 6,622,786 - Calmidi , et al. September 23, 2	2003-09-23

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