Call; Anson Jay
Patent Applications and Registrations
Patent applications and USPTO patent grants for Call; Anson Jay.The latest application filed is for "copper feature design for warpage control of substrates".
- Call; Anson Jay - Poughkeepsie NY
- Call; Anson Jay - Holmes NY
| Patent | Date |
|---|---|
| Copper feature design for warpage control of substrates Grant 9,659,131 - Blackshear , et al. May 23, 2 | 2017-05-23 |
| Copper Feature Design for Warpage Control of Substrates App 20150317423 - Blackshear; Edmund ; et al. | 2015-11-05 |
| Copper feature design for warpage control of substrates Grant 9,105,535 - Blackshear , et al. August 11, 2 | 2015-08-11 |
| Copper Feature Design for Warpage Control of Substrates App 20130334711 - Blackshear; Edmund ; et al. | 2013-12-19 |
| Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydroxymethylated phenolic or hydroxystyrene resin Grant 6,114,450 - Sachdev , et al. September 5, 2 | 2000-09-05 |
| Reworkable polymer chip encapsulant Grant 5,930,597 - Call , et al. July 27, 1 | 1999-07-27 |
| Reworkable polymer chip encapsulant Grant 5,659,203 - Call , et al. August 19, 1 | 1997-08-19 |
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