Call; Anson J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Call; Anson J..The latest application filed is for "connected plane stiffener within integrated circuit chip carrier".

Company Profile

12.22.12

Call; Anson J. - Poughkeepsie NY
Call; Anson J. - Holmes NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package metal shadowing checks Grant 10,956,649 - Call , et al. March 23, 2	2021-03-23
Connected plane stiffener within integrated circuit chip carrier Grant 10,770,385 - Call , et al. Sep	2020-09-08
Reduction of laminate failure in integrated circuit (IC) device carrier Grant 10,607,928 - Call , et al.	2020-03-31
Connected Plane Stiffener Within Integrated Circuit Chip Carrier App 20200035593 - Call; Anson J. ; et al.	2020-01-30
Semiconductor package via stack checking Grant 10,546,096 - Call , et al. Ja	2020-01-28
Semiconductor Package Metal Shadowing Checks App 20190377850 - Call; Anson J. ; et al.	2019-12-12
Split ball grid array pad for multi-chip modules Grant 10,483,233 - Call , et al. Nov	2019-11-19
Semiconductor package metal shadowing checks Grant 10,423,752 - Call , et al. Sept	2019-09-24
Reduction of solder interconnect stress Grant 10,276,534 - Call , et al.	2019-04-30
Method of fabricating contacts of an electronic package structure to reduce solder interconnect stress Grant 10,276,535 - Call , et al.	2019-04-30
Semiconductor Package Via Stack Checking App 20190102504 - Call; Anson J. ; et al.	2019-04-04
Semiconductor Package Metal Shadowing Checks App 20190102506 - Call; Anson J. ; et al.	2019-04-04
Laminate substrate thermal warpage prediction for designing a laminate substrate Grant 10,108,753 - Call , et al. October 23, 2	2018-10-23
Reduction Of Solder Interconnect Stress App 20180061799 - Call; Anson J. ; et al.	2018-03-01
Reduction Of Solder Interconnect Stress App 20180061800 - Call; Anson J. ; et al.	2018-03-01
Reduction of solder interconnect stress Grant 9,865,557 - Call , et al. January 9, 2	2018-01-09
Laminate Substrate Thermal Warpage Prediction For Designing A Laminate Substrate App 20170351783 - Call; Anson J. ; et al.	2017-12-07
Split Ball Grid Array Pad For Multi-chip Modules App 20170141078 - Call; Anson J. ; et al.	2017-05-18
Split ball grid array pad for multi-chip modules Grant 9,633,914 - Call , et al. April 25, 2	2017-04-25
Split Ball Grid Array Pad For Multi-chip Modules App 20170077000 - Call; Anson J. ; et al.	2017-03-16
In-plane copper imbalance for warpage prediction Grant 9,563,732 - Call , et al. February 7, 2	2017-02-07
Apparatus for crack prevention in integrated circuit packages Grant 7,786,579 - Audet , et al. August 31, 2	2010-08-31
Apparatus For Crack Prevention In Integrated Circuit Packages App 20080290510 - Audet; Jean ; et al.	2008-11-27
Electrically Conductive Liquid Piston Engine App 20080072597 - Call; Anson J.	2008-03-27
Method for assembling a carrier and a semiconductor device Grant 6,584,684 - Brofman , et al. July 1, 2	2003-07-01
Electrical interconnection package and method thereof Grant 6,333,563 - Jackson , et al. December 25, 2	2001-12-25
Structure, materials, and methods for socketable ball grid Grant 6,300,164 - Call , et al. October 9, 2	2001-10-09
Structure, materials, and applications of ball grid array interconnections Grant 6,297,559 - Call , et al. October 2, 2	2001-10-02
Method for assembling a carrier and a semiconductor device App 20010007288 - Brofman, Peter J. ; et al.	2001-07-12
Structure, materials, and methods for socketable ball grid Grant 6,120,885 - Call , et al. September 19, 2	2000-09-19
Method and solution for cleaning solder connections of electronic components Grant 5,759,285 - Buchwalter , et al. June 2, 1	1998-06-02
Method for forming chip carrier with a single protective encapsulant Grant 5,471,027 - Call , et al. November 28, 1	1995-11-28
Interconnection structure and test method Grant 5,147,084 - Behun , et al. September 15, 1	1992-09-15
Interconnection structure and test method Grant 5,060,844 - Behun , et al. October 29, 1	1991-10-29

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