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name:-0.015599012374878
name:-0.0048999786376953
name:-0.0083730220794678
Cai; Yuhong Patent Filings

Cai; Yuhong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cai; Yuhong.The latest application filed is for "die stack with cascade and vertical connections".

Company Profile
10.4.14
  • Cai; Yuhong - Folsom CA
  • Cai, Yuhong - Auckland NZ
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Die Stack With Cascade And Vertical Connections
App 20220037291 - Lai; Min-Tih Ted ;   et al.
2022-02-03
Die stack with cascade and vertical connections
Grant 11,171,114 - Lai , et al. November 9, 2
2021-11-09
Die Over Mold Stacked Semiconductor Package
App 20200343221 - PON; Florence ;   et al.
2020-10-29
Solder Mask Design For Delamination Prevention
App 20200135602 - ZHANG; James ;   et al.
2020-04-30
Choked Flow Cooling
App 20200135616 - FORSNES; Mark ;   et al.
2020-04-30
Semiconductor Package Design For Solder Joint Reliability
App 20200118901 - CAI; Yuhong ;   et al.
2020-04-16
Pad Design For Thermal Fatigue Resistance And Interconnect Joint Reliability
App 20200118955 - GOGINENI; Sireesha ;   et al.
2020-04-16
Dual Head Capillary Design For Vertical Wire Bond
App 20200118961 - CAI; Yuhong ;   et al.
2020-04-16
Bowl Shaped Pad
App 20200118954 - CAI; Yuhong ;   et al.
2020-04-16
Semiconductor package with thermal fins
Grant 10,573,575 - Kim , et al. Feb
2020-02-25
Semiconductor Package With Thermal Fins
App 20190067156 - Kim; Hyoung Il ;   et al.
2019-02-28
Stress Distribution Interposer For Mitigating Substrate Cracking
App 20190035720 - LAI; Min-Tih ;   et al.
2019-01-31
Ball pad with a plurality of lobes
Grant 10,192,840 - Cai , et al. Ja
2019-01-29
Die Stack With Cascade And Vertical Connections
App 20180366441 - Lai; Min-Tih Ted ;   et al.
2018-12-20
Local stress-relieving devices, systems, and methods for electronic assemblies
Grant 10,051,763 - Cai , et al. August 14, 2
2018-08-14
Local Stress-relieving Devices, Systems, And Methods For Electronic Assemblies
App 20180098421 - Cai; Yuhong ;   et al.
2018-04-05
Crack Resistant Electronic Device Package Substrates
App 20170186701 - Cai; Yuhong ;   et al.
2017-06-29
Software design system and method
App 20040237066 - Grundy, John ;   et al.
2004-11-25

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