loadpatents
Patent applications and USPTO patent grants for Cai; Yuhong.The latest application filed is for "die stack with cascade and vertical connections".
Patent | Date |
---|---|
Die Stack With Cascade And Vertical Connections App 20220037291 - Lai; Min-Tih Ted ;   et al. | 2022-02-03 |
Die stack with cascade and vertical connections Grant 11,171,114 - Lai , et al. November 9, 2 | 2021-11-09 |
Die Over Mold Stacked Semiconductor Package App 20200343221 - PON; Florence ;   et al. | 2020-10-29 |
Solder Mask Design For Delamination Prevention App 20200135602 - ZHANG; James ;   et al. | 2020-04-30 |
Choked Flow Cooling App 20200135616 - FORSNES; Mark ;   et al. | 2020-04-30 |
Semiconductor Package Design For Solder Joint Reliability App 20200118901 - CAI; Yuhong ;   et al. | 2020-04-16 |
Pad Design For Thermal Fatigue Resistance And Interconnect Joint Reliability App 20200118955 - GOGINENI; Sireesha ;   et al. | 2020-04-16 |
Dual Head Capillary Design For Vertical Wire Bond App 20200118961 - CAI; Yuhong ;   et al. | 2020-04-16 |
Bowl Shaped Pad App 20200118954 - CAI; Yuhong ;   et al. | 2020-04-16 |
Semiconductor package with thermal fins Grant 10,573,575 - Kim , et al. Feb | 2020-02-25 |
Semiconductor Package With Thermal Fins App 20190067156 - Kim; Hyoung Il ;   et al. | 2019-02-28 |
Stress Distribution Interposer For Mitigating Substrate Cracking App 20190035720 - LAI; Min-Tih ;   et al. | 2019-01-31 |
Ball pad with a plurality of lobes Grant 10,192,840 - Cai , et al. Ja | 2019-01-29 |
Die Stack With Cascade And Vertical Connections App 20180366441 - Lai; Min-Tih Ted ;   et al. | 2018-12-20 |
Local stress-relieving devices, systems, and methods for electronic assemblies Grant 10,051,763 - Cai , et al. August 14, 2 | 2018-08-14 |
Local Stress-relieving Devices, Systems, And Methods For Electronic Assemblies App 20180098421 - Cai; Yuhong ;   et al. | 2018-04-05 |
Crack Resistant Electronic Device Package Substrates App 20170186701 - Cai; Yuhong ;   et al. | 2017-06-29 |
Software design system and method App 20040237066 - Grundy, John ;   et al. | 2004-11-25 |
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