Cai; Chao-Feng
Patent Applications and Registrations
Patent applications and USPTO patent grants for Cai; Chao-Feng.The latest application filed is for "semiconductor packaging structure".
- Cai; Chao-Feng - Taoyuan TW
- CAI; Chao-Feng - Taoyuan City TW
| Patent | Date |
|---|---|
| Semiconductor packaging structure Grant 10,453,956 - Cai , et al. Oc | 2019-10-22 |
| Semiconductor Packaging Structure App 20190296150 - CAI; Chao-Feng ; et al. | 2019-09-26 |
| Semiconductor packaging structure and semiconductor power device thereof Grant 10,347,758 - Cai , et al. July 9, 2 | 2019-07-09 |
| Cascade switch device and voltage protection method Grant 9,973,185 - Li , et al. May 15, 2 | 2018-05-15 |
| Switching circuit Grant 9,917,574 - Cai March 13, 2 | 2018-03-13 |
| Semiconductor Packaging Structure And Semiconductor Power Device Thereof App 20170309746 - CAI; Chao-Feng ; et al. | 2017-10-26 |
| Semiconductor packaging structure and semiconductor power device thereof Grant 9,755,070 - Cai , et al. September 5, 2 | 2017-09-05 |
| Switching Circuit App 20160344381 - Cai; Chao-Feng | 2016-11-24 |
| Semiconductor Packaging Structure And Semiconductor Power Device Thereof App 20160293755 - CAI; Chao-Feng ; et al. | 2016-10-06 |
| Cascode Switch Device And Voltage Protection Method App 20160181788 - LI; Zeng ; et al. | 2016-06-23 |
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