Cadien; Kenneth C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cadien; Kenneth C..The latest application filed is for "introducing nanotubes in trenches and structures formed thereby".

Company Profile

0.19.17

Cadien; Kenneth C. - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Introducing nanotubes in trenches and structures formed thereby Grant 7,666,465 - Fischer , et al. February 23, 2	2010-02-23
Method of improving chemical mechanical polish endpoint signals by use of chemical additives Grant 7,182,882 - Feller , et al. February 27, 2	2007-02-27
Abrasives for chemical mechanical polishing Grant 7,087,188 - Cadien , et al. August 8, 2	2006-08-08
Methods for the plasma formation of a microelectronic barrier layer App 20060141780 - Cadien; Kenneth C.	2006-06-29
Introducing nanotubes in trenches and structures formed thereby App 20060141222 - Fischer; Paul B. ; et al.	2006-06-29
Copper containing abrasive particles to modify reactivity and performance of copper CMP slurries App 20060138087 - Simka; Harsono S. ; et al.	2006-06-29
Interconnects having a recessed capping layer and methods of fabricating the same App 20060128144 - Park; Hyun-Mog ; et al.	2006-06-15
Processing electronic devices using a combination of supercritical fluid and sonic energy App 20060065627 - Clarke; James ; et al.	2006-03-30
Abrasives for chemical mechanical polishing Grant 6,881,674 - Cadien , et al. April 19, 2	2005-04-19
Ceric-ion slurry for use in chemical-mechanical polishing App 20040203227 - Miller, Anne E. ; et al.	2004-10-14
Ceric-ion slurry for use in chemical-mechanical polishing App 20040203245 - Miller, Anne E. ; et al.	2004-10-14
Ceric-ion slurry for use in chemical-mechanical polishing Grant 6,752,844 - Miller , et al. June 22, 2	2004-06-22
Slurry and method for chemical mechanical polishing of copper Grant 6,740,591 - Miller , et al. May 25, 2	2004-05-25
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing Grant 6,719,614 - Miller , et al. April 13, 2	2004-04-13
Slurry and method for chemical mechanical polishing of copper App 20030211745 - Miller, Anne E. ; et al.	2003-11-13
Abrasives for chemical mechanical polishing App 20030143851 - Cadien, Kenneth C. ; et al.	2003-07-31
Abrasives For Chemical Mechanical Polishing App 20030129838 - CADIEN, KENNETH C. ; et al.	2003-07-10
Method of improving chemical mechanical polish endpoint signals by use of chemical additives App 20030124855 - Feller, Allen D. ; et al.	2003-07-03
Slurry and method for chemical mechanical polishing of copper App 20020177316 - Miller, Anne E. ; et al.	2002-11-28
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing Grant 6,443,814 - Miller , et al. September 3, 2	2002-09-03
Method And Chemistry For Cleaning Of Oxidized Copper During Chemical Mechanical Polishing App 20020106976 - Miller, Anne E. ; et al.	2002-08-08
Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing App 20020107155 - Miller, Anne E. ; et al.	2002-08-08
Method And Chemistry For Cleaning Of Oxidized Copper During Chemical Mechanical Polishing App 20020102922 - Miller, Anne E. ; et al.	2002-08-01
Ceric-ion Slurry For Use In Chemical-mechanical Polishing App 20020053656 - MILLER, ANNE E. ; et al.	2002-05-09
Ceria based slurry for chemical-mechanical polishing Grant 6,358,853 - Cadien , et al. March 19, 2	2002-03-19
Ceria Based Slurry For Chemical-mechanical Polishing App 20020004317 - CADIEN, KENNETH C. ; et al.	2002-01-10
Slurries for chemical mechanical polishing Grant 6,178,585 - Cadien , et al. January 30, 2	2001-01-30
Sacrificial erosion control features for chemical-mechanical polishing process Grant 6,087,733 - Maxim , et al. July 11, 2	2000-07-11
Method of frabricating a MOS transistor having a composite gate electrode Grant 5,783,478 - Chau , et al. July 21, 1	1998-07-21
Slurries and methods for chemical mechanical polish of aluminum and titanium aluminide Grant 5,700,383 - Feller , et al. December 23, 1	1997-12-23
MOS transistor having a composite gate electrode and method of fabrication Grant 5,625,217 - Chau , et al. April 29, 1	1997-04-29
Method and apparatus for conditioning of chemical-mechanical polishing pads Grant 5,611,943 - Cadien , et al. March 18, 1	1997-03-18
Integrated tungsten/tungsten silicide plug process Grant 5,604,158 - Cadien , et al. February 18, 1	1997-02-18
Slurries for chemical mechanical polishing Grant 5,516,346 - Cadien , et al. May 14, 1	1996-05-14
Chemical mechanical polishing slurry delivery and mixing system Grant 5,407,526 - Danielson , et al. April 18, 1	1995-04-18
Slurries for chemical mechanical polishing Grant 5,340,370 - Cadien , et al. August 23, 1	1994-08-23

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