| Patent | Date |
|---|
Bottom Package Exposed Die Mems Pressure Sensor Integrated Circuit Package Design
App 20220285249 - CADAG; Aaron ; et al. | 2022-09-08 |
Bottom package exposed die MEMS pressure sensor integrated circuit package design
Grant 11,355,423 - Cadag , et al. June 7, 2 | 2022-06-07 |
Tapeless Leadframe Package With Exposed Integrated Circuit Die
App 20220005857 - CADAG; Aaron ; et al. | 2022-01-06 |
Semiconductor Device Packages Having Cap With Integrated Electrical Leads
App 20210391226 - RODRIGUEZ; Rennier ; et al. | 2021-12-16 |
Leadless Semiconductor Package With Wettable Flanks And Method For Manufacturing The Same
App 20210313255 - ARELLANO; Ian Harvey ; et al. | 2021-10-07 |
Leadless semiconductor package with wettable flanks
Grant 11,069,601 - Arellano , et al. July 20, 2 | 2021-07-20 |
Package With Interlocking Leads And Manufacturing The Same
App 20210118818 - Cadag; Aaron ; et al. | 2021-04-22 |
QFN pre-molded leadframe having a solder wettable sidewall on each lead
Grant 10,910,295 - Cadag , et al. February 2, 2 | 2021-02-02 |
Package with interlocking leads and manufacturing the same
Grant 10,903,172 - Cadag , et al. January 26, 2 | 2021-01-26 |
Lead Stabilization In Semiconductor Packages
App 20200343168 - CADAG; Ela Mia ; et al. | 2020-10-29 |
Qfn Pre-molded Leadframe Having A Solder Wettable Sidewall On Each Lead
App 20200135623 - CADAG; Aaron ; et al. | 2020-04-30 |
Package With Interlocking Leads And Manufacturing The Same
App 20200118944 - Cadag; Aaron ; et al. | 2020-04-16 |
QFN pre-molded leadframe having a solder wettable sidewall on each lead
Grant 10,541,196 - Cadag , et al. Ja | 2020-01-21 |
Bottom Package Exposed Die Mems Pressure Sensor Integrated Circuit Package Design
App 20200020616 - CADAG; Aaron ; et al. | 2020-01-16 |
Package with interlocking leads and manufacturing the same
Grant 10,529,672 - Cadag , et al. J | 2020-01-07 |
Bottom package exposed die MEMS pressure sensor integrated circuit package design
Grant 10,483,191 - Cadag , et al. Nov | 2019-11-19 |
Package with backside protective layer during molding to prevent mold flashing failure
Grant 10,461,019 - Cadag , et al. Oc | 2019-10-29 |
Leadless Semiconductor Package With Wettable Flanks And Method For Manufacturing The Same
App 20190267311 - ARELLANO; Ian Harvey ; et al. | 2019-08-29 |
Package With Interlocking Leads And Manufacturing The Same
App 20190067212 - Cadag.; Aaron ; et al. | 2019-02-28 |
Package With Backside Protective Layer During Molding To Prevent Mold Flashing Failure
App 20190019745 - Cadag; Aaron ; et al. | 2019-01-17 |
Qfn Pre-molded Leadframe Having A Solder Wettable Sidewall On Each Lead
App 20180358286 - CADAG; Aaron ; et al. | 2018-12-13 |
Package With Backside Protective Layer During Molding To Prevent Mold Flashing Failure
App 20180331020 - CADAG; Aaron ; et al. | 2018-11-15 |
Package with backside protective layer during molding to prevent mold flashing failure
Grant 10,128,169 - Cadag , et al. November 13, 2 | 2018-11-13 |
QFN pre-molded leadframe having a solder wettable sidewall on each lead
Grant 10,079,198 - Cadag , et al. September 18, 2 | 2018-09-18 |
Flow over wire die attach film and conductive molding compound to provide an electromagnetic interference shield for a semiconductor die
Grant 9,953,933 - Cadag , et al. April 24, 2 | 2018-04-24 |
Bottom Package Exposed Die Mems Pressure Sensor Integrated Circuit Package Design
App 20180016133 - Cadag; Aaron ; et al. | 2018-01-18 |
Packaged Ic Devices And Associated Ic Device Packaging Methods
App 20150179477 - CADAG; AARON ; et al. | 2015-06-25 |
Compensating mold plunger for integrated circuit manufacture
Grant 9,022,773 - Cadag , et al. May 5, 2 | 2015-05-05 |
Compensating Mold Plunger For Integrated Circuit Manufacture
App 20130168898 - CADAG; Aaron ; et al. | 2013-07-04 |
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