Cablao; Philip Lyndon

Patent Applications and Registrations

Patent applications and USPTO patent grants for Cablao; Philip Lyndon.The latest application filed is for "integrated circuit packaging system with interconnect and method of manufacture thereof".

Company Profile

0.14.11

Cablao; Philip Lyndon - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation Grant 8,569,872 - Bathan , et al. October 29, 2	2013-10-29
Integrated circuit heat spreader stacking system Grant 8,421,221 - Filoteo, Jr. , et al. April 16, 2	2013-04-16
Integrated circuit package system with heatspreader Grant 8,395,254 - Espiritu , et al. March 12, 2	2013-03-12
Integrated circuit packaging system with interconnect and method of manufacture thereof Grant 8,344,495 - Camacho , et al. January 1, 2	2013-01-01
Integrated circuit packaging system with interconnect and method of manufacture thereof Grant 8,304,921 - Camacho , et al. November 6, 2	2012-11-06
Integrated circuit package system having interconnect stack and external interconnect Grant 8,138,080 - Filoteo, Jr. , et al. March 20, 2	2012-03-20
Stacked integrated circuits package system with passive components Grant 8,026,129 - Cablao , et al. September 27, 2	2011-09-27
Integrated Circuit Packaging System With Interconnect And Method Of Manufacture Thereof App 20110140261 - Camacho; Zigmund Ramirez ; et al.	2011-06-16
Integrated Circuit Packaging System With Interconnect And Method Of Manufacture Thereof App 20110115065 - Camacho; Zigmund Ramirez ; et al.	2011-05-19
Integrated circuit packaging system with interposer Grant 7,911,046 - Cablao , et al. March 22, 2	2011-03-22
Integrated Circuit Heat Spreader Stacking System App 20100224991 - Filoteo, JR.; Dario S. ; et al.	2010-09-09
Integrated circuit heat spreader stacking method Grant 7,759,169 - Filoteo, Jr. , et al. July 20, 2	2010-07-20
Integrated Circuit Package System With Lead-frame Paddle Scheme For Single Axis Partial Saw Isolation App 20100001384 - Bathan; Henry Descalzo ; et al.	2010-01-07
Integrated Circuit Packaging System With Interposer App 20090152704 - Cablao; Philip Lyndon ; et al.	2009-06-18
Integrated circuit packaging system with interposer Grant 7,518,226 - Cablao , et al. April 14, 2	2009-04-14
Integrated circuit package-in-package system Grant 7,439,620 - Merilo , et al. October 21, 2	2008-10-21
Integrated Circuit Packaging System With Interposer App 20080185719 - Cablao; Philip Lyndon ; et al.	2008-08-07
Integrated Circuit Package-in-package System App 20080029905 - Merilo; Leo A. ; et al.	2008-02-07
Integrated Circuit Heat Spreader Stacking System App 20080012122 - Filoteo; Dario S. ; et al.	2008-01-17
Integrated Circuit Package System With Heatspreader App 20070235859 - Espiritu; Emmanuel ; et al.	2007-10-11
Stacked Integrated Circuits Package System With Passive Components App 20070210432 - Cablao; Philip Lyndon ; et al.	2007-09-13
Integrated Circuit Package System App 20070210436 - Filoteo; Dario S. JR. ; et al.	2007-09-13

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