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Patent applications and USPTO patent grants for Cabatbat; Edmund Sales.The latest application filed is for "semiconductor package including leads of different lengths".
Patent | Date |
---|---|
Semiconductor package including leads of different lengths Grant 11,417,538 - Gan , et al. August 16, 2 | 2022-08-16 |
Semiconductor Package Including Leads Of Different Lengths App 20210366728 - Gan; Thai Kee ;   et al. | 2021-11-25 |
Multi-branch terminal for integrated circuit (IC) package Grant 10,971,436 - Stoek , et al. April 6, 2 | 2021-04-06 |
Wire bonded package with single piece exposed heat slug and leads Grant 10,840,164 - Hong , et al. November 17, 2 | 2020-11-17 |
Multi-branch Terminal For Integrated Circuit (ic) Package App 20200020618 - STOEK; Thomas ;   et al. | 2020-01-16 |
Wire Bonded Package with Single Piece Exposed Heat Slug and Leads App 20190355643 - Hong; Chii Shang ;   et al. | 2019-11-21 |
Multi-branch terminal for integrated circuit (IC) package Grant 10,354,943 - Stoek , et al. July 16, 2 | 2019-07-16 |
Semiconductor package with heat slug and rivet free die attach area Grant 10,083,899 - Bajuri , et al. September 25, 2 | 2018-09-25 |
Semiconductor Package With Heat Slug And Rivet Free Die Attach Area App 20180211907 - Bajuri; Mohd Kahar ;   et al. | 2018-07-26 |
Color yield of white LEDs Grant 9,048,397 - Cabatbat , et al. June 2, 2 | 2015-06-02 |
Color Yield Of White Leds App 20150087087 - Cabatbat; Edmund Sales ;   et al. | 2015-03-26 |
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