Byun; Jung Soo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Byun; Jung Soo.The latest application filed is for "fan-out semiconductor package".

Company Profile

7.17.23

Byun; Jung Soo - Suwon-si KR
BYUN; Jung Soo - Anyang-si KR
Byun; Jung Soo - Anyang KR
Byun; Jung Soo - Gyunggi-do KR
Byun; Jung Soo - Yongin-si N/A KR
- Anyang-si KR
BYUN; Jung Soo - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package Grant 11,189,552 - Lee , et al. November 30, 2	2021-11-30
Fan-out Semiconductor Package App 20210151370 - CHOI; Ik Jun ; et al.	2021-05-20
Fan-out semiconductor package Grant 10,916,495 - Choi , et al. February 9, 2	2021-02-09
Semiconductor package Grant 10,796,997 - Lee , et al. October 6, 2	2020-10-06
Carrier substrate and method of manufacturing semiconductor package using the same Grant 10,790,224 - Lee , et al. September 29, 2	2020-09-29
Semiconductor Package App 20200266137 - LEE; Jae Ean ; et al.	2020-08-20
Semiconductor package Grant 10,665,535 - Lee , et al.	2020-05-26
Semiconductor Package App 20200066639 - LEE; Jae Ean ; et al.	2020-02-27
Semiconductor package Grant 10,446,478 - Jeong , et al. Oc	2019-10-15
Carrier substrate and method of manufacturing semiconductor package using the same Grant 10,438,884 - Lee , et al. O	2019-10-08
Carrier Substrate And Method Of Manufacturing Semiconductor Package Using The Same App 20190259697 - LEE; Jae Ean ; et al.	2019-08-22
Carrier Substrate And Method Of Manufacturing Semiconductor Package Using The Same App 20190164876 - LEE; Jae Ean ; et al.	2019-05-30
Semiconductor Package App 20190131225 - JEONG; Kwang Ok ; et al.	2019-05-02
Fan-out Semiconductor Package App 20190131224 - Choi; Ik Jun ; et al.	2019-05-02
Semiconductor Package App 20190131221 - LEE; Jae Ean ; et al.	2019-05-02
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate App 20160212856 - KIM; Hong Won ; et al.	2016-07-21
Chip-embedded printed circuit board and semiconductor package using the PCB, and manufacturing method of the PCB Grant 9,392,698 - Hong , et al. July 12, 2	2016-07-12
Electronic Component-embedded Substrate And Manufacturing Method Thereof App 20150085455 - KIM; Hong Won ; et al.	2015-03-26
Method For Manufacturing Electronic Component Embedding Substrate And Electronic Component Embedding Substrate App 20150049445 - KIM; Hong Won ; et al.	2015-02-19
Printed circuit board having electronic components embedded therein Grant 8,942,004 - Hong , et al. January 27, 2	2015-01-27
Embedded printed circuit board and method of manufacturing the same Grant 8,881,382 - Lee , et al. November 11, 2	2014-11-11
Chip-embedded Printed Circuit Board And Semiconductor Package Using The Pcb, And Manufacturing Method Of The Pcb App 20140159222 - HONG; Suk Chang ; et al.	2014-06-12
System for assessing an environmental load of building during life cycle Grant 8,645,183 - Shin , et al. February 4, 2	2014-02-04
Electronics component embedded PCB Grant 8,618,421 - Byun , et al. December 31, 2	2013-12-31
Electronics component embedded PCB Grant 08618421 -	2013-12-31
Semiconductor Package And Method Of Manufacturing The Same App 20130119553 - JEONG; Tae Sung ; et al.	2013-05-16
System For Assessing An Environmental Load Of Building During Life Cycle App 20130090972 - Shin; Sung Woo ; et al.	2013-04-11
Embedded printed circuit board and method of manufacturing the same Grant 8,339,796 - Lee , et al. December 25, 2	2012-12-25
Printed Circuit Board Having Embedded Electronic Component And Method Of Manufacturing The Same App 20120160549 - Kim; Moon Il ; et al.	2012-06-28
Printed Circuit Board Having Eletronic Components Embedded Therein App 20120087097 - HONG; Suk Chang ; et al.	2012-04-12
Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20120073747 - LEE; Sang Chul ; et al.	2012-03-29
Embedded Printed Circuit Board And Method Of Manufacturing The Same App 20120075818 - LEE; Sang Chul ; et al.	2012-03-29
Method of manufacturing printed circuit board including electronic component embedded therein App 20110314667 - Baek; Sang Jin ; et al.	2011-12-29
Electronics Component Embedded Pcb App 20110100689 - BYUN; Jung-Soo ; et al.	2011-05-05
Printed circuit board including electronic component embedded therein and method of manufacturing the same App 20090310323 - Baek; Sang Jin ; et al.	2009-12-17

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