Byun; Jin Do
Patent Applications and Registrations
Patent applications and USPTO patent grants for Byun; Jin Do.The latest application filed is for "nonvolatile memory chip and semiconductor package including the same".
- Byun; Jin Do - Suwon-si KR
- Byun; Jin do - Anyang-si KR
| Patent | Date |
|---|---|
| Nonvolatile Memory Chip And Semiconductor Package Including The Same App 20220157845 - LEE; MIN JAE ; et al. | 2022-05-19 |
| Multi-chip package Grant 11,244,738 - Na , et al. February 8, 2 | 2022-02-08 |
| Multi-chip package Grant 11,017,877 - Na , et al. May 25, 2 | 2021-05-25 |
| Multi-chip Package App 20200365225 - NA; Dae Hoon ; et al. | 2020-11-19 |
| Multi-chip Package App 20200227131 - NA; Dae Hoon ; et al. | 2020-07-16 |
| Folded corrugated substrate integrated waveguide Grant 9,543,628 - Lee , et al. January 10, 2 | 2017-01-10 |
| Antenna and communication system including the antenna Grant 9,525,211 - Lee , et al. December 20, 2 | 2016-12-20 |
| Folded Courrugated Substrate Integrated Waveguide App 20150318598 - LEE; Hai Young ; et al. | 2015-11-05 |
| Phase shifter using substrate integrated waveguide Grant 9,136,579 - Lee , et al. September 15, 2 | 2015-09-15 |
| Antenna And Communication System Including The Antenna App 20140184456 - LEE; Byung Moo ; et al. | 2014-07-03 |
| Phase Shifter Using Substrate Integrated Waveguide App 20120274419 - Lee; Hai-Young ; et al. | 2012-11-01 |
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