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name:-0.071166038513184
name:-0.062292098999023
name:-0.006321907043457
Byun; Jeong Soo Patent Filings

Byun; Jeong Soo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Byun; Jeong Soo.The latest application filed is for "radical oxidation process for fabricating a nonvolatile charge trap memory device".

Company Profile
5.53.45
  • Byun; Jeong Soo - Cupertino CA
  • Byun; Jeong Soo - Chungcheongbuk-do KR
  • Byun; Jeong Soo - Cheongju KR
  • Byun; Jeong Soo - Seoul KR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Radical Oxidation Process For Fabricating A Nonvolatile Charge Trap Memory Device
App 20200287056 - Ramkumar; Krishnaswamy ;   et al.
2020-09-10
Oxide Formation In A Plasma Process
App 20200161324 - Byun; Jeong Soo ;   et al.
2020-05-21
Radical Oxidation Process For Fabricating A Nonvolatile Charge Trap Memory Device
App 20200161478 - Ramkumar; Krishnaswarmy ;   et al.
2020-05-21
Radical oxidation process for fabricating a nonvolatile charge trap memory device
Grant 10,593,812 - Ramkumar , et al.
2020-03-17
Oxide formation in a plasma process
Grant 10,319,733 - Byun , et al.
2019-06-11
Radical oxidation process for fabricating a nonvolatile charge trap memory device
Grant 10,304,968 - Ramkumar , et al.
2019-05-28
Oxide Formation In A Plasma Process
App 20190088669 - Byun; Jeong Soo ;   et al.
2019-03-21
Radical Oxidation Process For Fabricating A Nonvolatile Charge Trap Memory Device
App 20180351004 - Ramkumar; Krishnaswamy ;   et al.
2018-12-06
Oxide formation in a plasma process
Grant 10,128,258 - Byun , et al. November 13, 2
2018-11-13
Oxide Formation In A Plasma Process
App 20170005108 - Byun; Jeong Soo ;   et al.
2017-01-05
Oxide formation in a plasma process
Grant 9,460,974 - Byun , et al. October 4, 2
2016-10-04
Oxide formation in a plasma process
Grant 9,406,574 - Byun , et al. August 2, 2
2016-08-02
Radical Oxidation Process For Fabricating A Nonvolatile Charge Trap Memory Device
App 20150187960 - Ramkumar; Krishnaswamy ;   et al.
2015-07-02
Atomic layer deposition apparatus
Grant 9,031,685 - Chin , et al. May 12, 2
2015-05-12
Oxide formation in a plasma process
Grant 8,822,349 - Byun , et al. September 2, 2
2014-09-02
Atomic Layer Deposition Apparatus
App 20140130739 - CHIN; Barry L. ;   et al.
2014-05-15
Methods for fabricating semiconductor memory with process induced strain
Grant 8,691,648 - Polishchuk , et al. April 8, 2
2014-04-08
Atomic layer deposition apparatus
Grant 8,626,330 - Chin , et al. January 7, 2
2014-01-07
Method for forming image sensor with shield structures
Grant 8,168,933 - Byun , et al. May 1, 2
2012-05-01
Oxide formation in a plasma process
Grant 8,119,538 - Byun , et al. February 21, 2
2012-02-21
Image sensor with a reflective waveguide
Grant 8,110,787 - Byun , et al. February 7, 2
2012-02-07
Atomic Layer Deposition Apparatus
App 20120006265 - CHIN; BARRY L. ;   et al.
2012-01-12
Method For Forming Image Sensor With Shield Structures
App 20120003782 - Byun; Jeong Soo ;   et al.
2012-01-05
Atomic layer deposition apparatus
Grant 8,027,746 - Chin , et al. September 27, 2
2011-09-27
Atomic Layer Deposition Apparatus
App 20110111603 - CHIN; BARRY L. ;   et al.
2011-05-12
Atomic layer deposition apparatus
Grant 7,860,597 - Chin , et al. December 28, 2
2010-12-28
Method for forming tungsten materials during vapor deposition processes
Grant 7,846,840 - Kori , et al. December 7, 2
2010-12-07
Methods for depositing tungsten after surface treatment
Grant 7,749,815 - Byun July 6, 2
2010-07-06
Methods for depositing tungsten layers employing atomic layer deposition techniques
Grant 7,745,333 - Lai , et al. June 29, 2
2010-06-29
Atomic Layer Deposition Apparatus
App 20100099270 - Chin; Barry L. ;   et al.
2010-04-22
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20100093170 - Kori; Moris ;   et al.
2010-04-15
Method for forming tungsten materials during vapor deposition processes
Grant 7,674,715 - Kori , et al. March 9, 2
2010-03-09
Atomic layer deposition apparatus
Grant 7,660,644 - Chin , et al. February 9, 2
2010-02-09
Formation of composite tungsten films
Grant 7,605,083 - Lai , et al. October 20, 2
2009-10-20
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20090156004 - KORI; MORIS ;   et al.
2009-06-18
Formation of boride barrier layers using chemisorption techniques
Grant 7,501,343 - Byun , et al. March 10, 2
2009-03-10
Formation of boride barrier layers using chemisorption techniques
Grant 7,501,344 - Byun , et al. March 10, 2
2009-03-10
Forming metal silicide on silicon-containing features of a substrate
Grant 7,485,556 - Byun , et al. February 3, 2
2009-02-03
Method for forming tungsten materials during vapor deposition processes
Grant 7,465,666 - Kori , et al. December 16, 2
2008-12-16
Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques
App 20080280438 - Lai; Ken Kaung ;   et al.
2008-11-13
Formation Of Composite Tungsten Films
App 20080227291 - LAI; KEN K. ;   et al.
2008-09-18
Methods for depositing tungsten layers employing atomic layer deposition techniques
Grant 7,405,158 - Lai , et al. July 29, 2
2008-07-29
Low Temperature Oxide Formation
App 20080166893 - Byun; Jeong Soo ;   et al.
2008-07-10
Formation of composite tungsten films
Grant 7,384,867 - Lai , et al. June 10, 2
2008-06-10
Methods For Depositing Tungsten After Surface Treatment
App 20080014724 - Byun; Jeong Soo
2008-01-17
In-situ-etch-assisted HDP deposition
Grant 7,294,588 - Karim , et al. November 13, 2
2007-11-13
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20070254481 - KORI; MORIS ;   et al.
2007-11-01
Formation Of Boride Barrier Layers Using Chemisorption Techniques
App 20070197027 - Byun; Jeong Soo ;   et al.
2007-08-23
Formation Of Boride Barrier Layers Using Chemisorption Techniques
App 20070197028 - Byun; Jeong Soo ;   et al.
2007-08-23
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
Grant 7,238,552 - Byun July 3, 2
2007-07-03
Method for forming tungsten materials during vapor deposition processes
Grant 7,235,486 - Kori , et al. June 26, 2
2007-06-26
Formation of boride barrier layers using chemisorption techniques
Grant 7,208,413 - Byun , et al. April 24, 2
2007-04-24
Method For Forming Tungsten Materials During Vapor Deposition Processes
App 20060292874 - Kori; Moris ;   et al.
2006-12-28
Atomic Layer Deposition Apparatus
App 20060223286 - Chin; Barry L. ;   et al.
2006-10-05
Method and system for controlling the presence of fluorine in refractory metal layers
Grant 7,115,494 - Sinha , et al. October 3, 2
2006-10-03
Forming metal silicide on silicon-containing features of a substrate
App 20060211202 - Byun; Jeong Soo ;   et al.
2006-09-21
Atomic layer deposition apparatus
Grant 7,085,616 - Chin , et al. August 1, 2
2006-08-01
In-situ-etch-assisted HDP deposition
App 20060166515 - Karim; M. Ziaul ;   et al.
2006-07-27
Method and system for controlling the presence of fluorine in refractory metal layers
App 20060128132 - Sinha; Ashok ;   et al.
2006-06-15
In-situ-etch-assisted HDP deposition using SiF.sub.4
Grant 7,049,211 - Karim , et al. May 23, 2
2006-05-23
Method and system for controlling the presence of fluorine in refractory metal layers
Grant 7,033,922 - Kori , et al. April 25, 2
2006-04-25
Gap filling with a composite layer
Grant 7,033,945 - Byun , et al. April 25, 2
2006-04-25
Methods for depositing tungsten layers employing atomic layer deposition techniques
App 20060009034 - Lai; Ken Kaung ;   et al.
2006-01-12
Formation of composite tungsten films
App 20050287807 - Lai, Ken K. ;   et al.
2005-12-29
Gap filling with a composite layer
App 20050277257 - Byun, Jeong Soo ;   et al.
2005-12-15
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
App 20050208763 - Byun, Jeong Soo
2005-09-22
Formation of composite tungsten films
Grant 6,939,804 - Lai , et al. September 6, 2
2005-09-06
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
Grant 6,936,538 - Byun August 30, 2
2005-08-30
In-situ-etch-assisted HDP deposition using SiF4
App 20050164517 - Karim, M. Ziaul ;   et al.
2005-07-28
In-situ-etch-assisted HDP deposition using SiF4 and hydrogen
Grant 6,903,031 - Karim , et al. June 7, 2
2005-06-07
Formation of boride barrier layers using chemisorption techniques
App 20050118804 - Byun, Jeong Soo ;   et al.
2005-06-02
Method and system for controlling the presence of fluorine in refractory metal layers
App 20050059241 - Kori, Moris ;   et al.
2005-03-17
In-situ-etch-assisted HDP deposition using SiF4 and hydrogen
App 20050048801 - Karim, M. Ziaul ;   et al.
2005-03-03
Method and system for controlling the presence of fluorine in refractory metal layers
Grant 6,855,368 - Kori , et al. February 15, 2
2005-02-15
System and method to form a composite film stack utilizing sequential deposition techniques
Grant 6,849,545 - Mak , et al. February 1, 2
2005-02-01
Formation of boride barrier layers using chemisorption techniques
Grant 6,831,004 - Byun , et al. December 14, 2
2004-12-14
Formation of boride barrier layers using chemisorption techniques
App 20040018723 - Byun, Jeong Soo ;   et al.
2004-01-29
Formation of titanium nitride films using a cyclical deposition process
App 20040013803 - Chung, Hua ;   et al.
2004-01-22
Formation of composite tungsten films
App 20040014315 - Lai, Ken K. ;   et al.
2004-01-22
Metal nitride formation
App 20030224217 - Byun, Jeong Soo ;   et al.
2003-12-04
Formation of boride barrier layers using chemisorption techniques
Grant 6,620,723 - Byun , et al. September 16, 2
2003-09-16
Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques
Grant 6,551,929 - Kori , et al. April 22, 2
2003-04-22
Method of titanium and titanium nitride layer deposition
App 20030072884 - Zhang, Tong ;   et al.
2003-04-17
Selective tungsten stud as copper diffusion barrier to silicon contact
App 20030073304 - Mak, Alfred ;   et al.
2003-04-17
Formation of refractory metal nitrides using chemisorption techniques
App 20030049931 - Byun, Jeong Soo ;   et al.
2003-03-13
Atomic layer deposition apparatus
App 20030023338 - Chin, Barry L. ;   et al.
2003-01-30
Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
App 20030013300 - Byun, Jeong Soo
2003-01-16
System and method to form a composite film stack utilizing sequential deposition techniques
App 20020197863 - Mak, Alfred W. ;   et al.
2002-12-26
Method of forming refractory metal nitride layers using chemisorption techniques
App 20020086111 - Byun, Jeong Soo ;   et al.
2002-07-04
Method for fabricating semiconductor device having improved step coverage and low resistivity contacts
Grant 6,221,762 - Byun , et al. April 24, 2
2001-04-24
Method for forming epitaxial Co self-align silicide for semiconductor device
Grant 6,077,750 - Sohn , et al. June 20, 2
2000-06-20
Method for forming a silicide layer in a semiconductor device
Grant 5,824,600 - Byun , et al. October 20, 1
1998-10-20
Method of forming electrode of semiconductor device
Grant 5,744,398 - Byun , et al. April 28, 1
1998-04-28
Method for the formation of polycide gate in semiconductor device
Grant 5,712,181 - Byun , et al. January 27, 1
1998-01-27
Method for forming refractory metal nitride film
Grant 5,665,209 - Byun September 9, 1
1997-09-09

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