Byun; Jae-bum
Patent Applications and Registrations
Patent applications and USPTO patent grants for Byun; Jae-bum.The latest application filed is for "multi-stacked structures of semiconductor packages".
- Byun; Jae-bum - Gyeonggi-do KR
- Byun; Jae-Bum - Suwon-si KR
| Patent | Date |
|---|---|
| Storage device Grant 9,668,377 - Lim , et al. May 30, 2 | 2017-05-30 |
| Multi-stacked structures of semiconductor packages Grant 9,564,417 - Byun , et al. February 7, 2 | 2017-02-07 |
| Multi-Stacked Structures of Semiconductor Packages App 20160086917 - Byun; Jae-Bum ; et al. | 2016-03-24 |
| Storage Device App 20140022733 - Lim; Gwang-Man ; et al. | 2014-01-23 |
| Semiconductor Package Having Heat Spreader And Method Of Forming The Same App 20130208426 - Kim; Jae-Choon ; et al. | 2013-08-15 |
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