BYUN; Hyung-Jik

Patent Applications and Registrations

Patent applications and USPTO patent grants for BYUN; Hyung-Jik.The latest application filed is for "semiconductor package having molded balls and method of manufacturing the same".

Company Profile

0.2.6

BYUN; Hyung-Jik - Gyeonggi-do KR
Byun; Hyung-Jik - Cheonan-si KR
Byun; Hyung Jik - Chungcheongnam-do KR
Byun, Hyung Jik - Cheonan-city KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Having Molded Balls And Method Of Manufacturing The Same App 20080290513 - BYUN; Hyung-Jik ; et al.	2008-11-27
Semiconductor package and method for manufacturing the same App 20080088037 - Byun; Hyung-Jik ; et al.	2008-04-17
PCB, manufacturing method thereof and semiconductor package implementing the same App 20060131067 - Byun; Hyung-Jik ; et al.	2006-06-22
Multi-chip package having spacer that is inserted between chips and manufacturing method thereof Grant 7,023,096 - Lee , et al. April 4, 2	2006-04-04
Semiconductor chip package comprising enhanced pads Grant 6,736,306 - Byun , et al. May 18, 2	2004-05-18
Multi-chip package having spacer that is inserted between chips and manufacturing method thereof App 20030062628 - Lee, Kyu Jin ; et al.	2003-04-03
Tape ball grid array semiconductor chip package having ball land pad isolated from adhesive, a method of manufacturing the same and a multi-chip package App 20030025190 - Byun, Hyung Jik ; et al.	2003-02-06
Semiconductor chip package comprising enhanced pads App 20020104874 - Byun, Hyung-Jik ; et al.	2002-08-08

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