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Patent applications and USPTO patent grants for Byun; Gwang-Seon.The latest application filed is for "method of analyzing lattice strain of semiconductor device".
Patent | Date |
---|---|
Method of analyzing lattice strain of semiconductor device Grant 10,410,332 - Ahn , et al. Sept | 2019-09-10 |
Method Of Analyzing Lattice Strain Of Semiconductor Device App 20180012348 - AHN; MYOUNG-KI ;   et al. | 2018-01-11 |
Fuse box, method of forming a fuse box, and fuse cutting method Grant 7,576,408 - Byun , et al. August 18, 2 | 2009-08-18 |
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same App 20070114635 - Cho; Tai-Heui ;   et al. | 2007-05-24 |
Fuse Box, Method Of Forming A Fuse Box, And Fuse Cutting Method App 20070115745 - BYUN; Gwang-Seon ;   et al. | 2007-05-24 |
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same Grant 7,180,154 - Cho , et al. February 20, 2 | 2007-02-20 |
Integrated circuit devices having corrosion resistant fuse regions and methods of fabricating the same App 20040262768 - Cho, Tai-Heui ;   et al. | 2004-12-30 |
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