BYRD; Gerald Cois
Patent Applications and Registrations
Patent applications and USPTO patent grants for BYRD; Gerald Cois.The latest application filed is for "optoelectronic module package".
- BYRD; Gerald Cois - Shadow Hills CA
- Byrd; Gerald Cois - Shadows Hills CA
| Patent | Date |
|---|---|
| Optoelectronic Module Package App 20220262962 - BYRD; Gerald Cois ; et al. | 2022-08-18 |
| Electro-optical Package And Method Of Fabrication App 20220189841 - LI; Shuhe ; et al. | 2022-06-16 |
| Optoelectronic Device App 20220163824 - OH; James Dongyoon ; et al. | 2022-05-26 |
| Optoelectronic Module Package App 20220109075 - BYRD; Gerald Cois ; et al. | 2022-04-07 |
| Module with transmit optical subassembly and receive optical subassembly Grant 11,262,498 - Byrd , et al. March 1, 2 | 2022-03-01 |
| Optoelectronic module package Grant 11,239,377 - Byrd , et al. February 1, 2 | 2022-02-01 |
| Optoelectronic device Grant 11,209,678 - Oh , et al. December 28, 2 | 2021-12-28 |
| Mode converter and method of fabricating thereof Grant 11,133,225 - Drake , et al. September 28, 2 | 2021-09-28 |
| Copackaging of asic and silicon photonics Grant 10,877,217 - Byrd , et al. December 29, 2 | 2020-12-29 |
| Module With Transmit Optical Subassembly And Receive Optical Subassembly App 20200363585 - Byrd; Gerald Cois ; et al. | 2020-11-19 |
| Module with transmit and receive optical subassemblies with specific pic cooling architecture Grant 10,761,262 - Byrd , et al. Sep | 2020-09-01 |
| Mode Converter And Method Of Fabricating Thereof App 20200258791 - A1 | 2020-08-13 |
| Copackaging Of Asic And Silicon Photonics App 20200073050 - Byrd; Gerald Cois ; et al. | 2020-03-05 |
| Optoelectronic Device App 20190258094 - Oh; Dong Yoon ; et al. | 2019-08-22 |
| Copackaging of ASIC and silicon photonics Grant 10,365,436 - Byrd , et al. July 30, 2 | 2019-07-30 |
| Interposer beam expander chip Grant 10,317,620 - Rickman , et al. | 2019-06-11 |
| Module With Transmit Optical Subassembly And Receive Optical Subassembly App 20190041576 - Byrd; Gerald Cois ; et al. | 2019-02-07 |
| Optoelectronic Module Package App 20190044002 - Byrd; Gerald Cois ; et al. | 2019-02-07 |
| Copackaging Of Asic And Silicon Photonics App 20180196196 - Byrd; Gerald Cois ; et al. | 2018-07-12 |
| Interposer Beam Expander Chip App 20170003450 - Rickman; Andrew George ; et al. | 2017-01-05 |
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