Butterbaugh; Matthew A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Butterbaugh; Matthew A..The latest application filed is for "cable management bracket".
- Butterbaugh; Matthew A. - Rochester MN
- Butterbaugh; Matthew A - Rochester MN
| Patent | Date |
|---|---|
| Cable management bracket Grant 10,172,250 - Babcock , et al. J | 2019-01-01 |
| Cable management bracket Grant 10,117,348 - Babcock , et al. October 30, 2 | 2018-10-30 |
| Cable Management Bracket App 20180263135 - Babcock; Raymond F. ; et al. | 2018-09-13 |
| Cable Management Bracket App 20180263134 - Babcock; Raymond F. ; et al. | 2018-09-13 |
| Cable management bracket Grant 9,894,793 - Babcock , et al. February 13, 2 | 2018-02-13 |
| Modular enclosure elements employing cams forming detent features with latches Grant 9,769,941 - Butterbaugh , et al. September 19, 2 | 2017-09-19 |
| Method for securing and removing modular elements employing latches Grant 9,763,355 - Butterbaugh , et al. September 12, 2 | 2017-09-12 |
| Indicator module for modular computing units Grant 9,715,795 - Butterbaugh , et al. July 25, 2 | 2017-07-25 |
| Modular elements employing latches with flexure bearings Grant 9,686,883 - Butterbaugh , et al. June 20, 2 | 2017-06-20 |
| Heat exchangers for cooling integrated circuits Grant 9,655,287 - Babcock , et al. May 16, 2 | 2017-05-16 |
| Sleeve electromagnetic shield Grant 9,618,984 - Butterbaugh , et al. April 11, 2 | 2017-04-11 |
| Air-cooled heatsink for cooling integrated circuits Grant 9,609,785 - Babcock , et al. March 28, 2 | 2017-03-28 |
| Multiple-backplane implementations for modular platforms Grant 9,591,784 - Butterbaugh , et al. March 7, 2 | 2017-03-07 |
| Modular enclosure elements employing cams forming detent features with latches Grant 9,497,871 - Butterbaugh , et al. November 15, 2 | 2016-11-15 |
| Sleeve Electromagnetic Shield App 20160224074 - Butterbaugh; Matthew A. ; et al. | 2016-08-04 |
| Modular Elements Employing Latches Secured By Linkages App 20160198600 - BUTTERBAUGH; Matthew A. ; et al. | 2016-07-07 |
| Modular elements employing latches secured by linkages Grant 9,386,713 - Butterbaugh , et al. July 5, 2 | 2016-07-05 |
| Modular elements employing latches secured by linkages Grant 9,386,736 - Butterbaugh , et al. July 5, 2 | 2016-07-05 |
| Modular Elements Employing Latches Secured By Linkages App 20160192521 - Butterbaugh; Matthew A. ; et al. | 2016-06-30 |
| Modular Elements Employing Latches With Flexure Bearings App 20160192520 - BUTTERBAUGH; Matthew A. ; et al. | 2016-06-30 |
| Modular Elements Employing Latches With Flexure Bearings App 20160192529 - BUTTERBAUGH; Matthew A. ; et al. | 2016-06-30 |
| Modular Enclosure Elements Employing Cams Forming Detent Features With Latches App 20160183396 - BUTTERBAUGH; Matthew A. ; et al. | 2016-06-23 |
| Modular Enclosure Elements Employing Cams Forming Detent Features With Latches App 20160183395 - BUTTERBAUGH; Matthew A. ; et al. | 2016-06-23 |
| Indicator Module For Modular Computing Units App 20160125706 - BUTTERBAUGH; Matthew A. ; et al. | 2016-05-05 |
| Multiple-backplane Implementations For Modular Platforms App 20160128221 - BUTTERBAUGH; Matthew A. ; et al. | 2016-05-05 |
| Support structure for installation of a component assembly housed in a rotating, translating carriage chassis Grant 9,007,084 - Babcock , et al. April 14, 2 | 2015-04-14 |
| Fail to wire removable module for network communication link Grant 8,717,872 - Babcock , et al. May 6, 2 | 2014-05-06 |
| Fail to wire removable module for network communication link Grant 8,693,309 - Babcock , et al. April 8, 2 | 2014-04-08 |
| Fail To Wire Removable Module For Network Communication Link App 20130121134 - Babcock; Raymond F. ; et al. | 2013-05-16 |
| Fail To Wire Removable Module For Network Communication Link App 20130121139 - Babcock; Raymond F. ; et al. | 2013-05-16 |
| Support Structure For Installation Of A Component Assembly Housed In A Rotating, Translating Carriage Chassis App 20110304344 - Babcock; Raymond F. ; et al. | 2011-12-15 |
| Heatsink and package structures with fusible release layer Grant 6,084,775 - Bartley , et al. July 4, 2 | 2000-07-04 |
| Cooling apparatus for electronic chips Grant 5,630,469 - Butterbaugh , et al. May 20, 1 | 1997-05-20 |
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