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Patent applications and USPTO patent grants for Butterbach; Ruediger.The latest application filed is for "thermally conductive adhesive".
Patent | Date |
---|---|
Thermally conductive adhesive Grant 10,689,551 - Butterbach , et al. | 2020-06-23 |
Hot melt adhesive containing a polyamide/ polyolefin hybrid polymer Grant 10,040,981 - Marchese , et al. August 7, 2 | 2018-08-07 |
Thermally Conductive Adhesive App 20170362473 - BUTTERBACH; Ruediger ;   et al. | 2017-12-21 |
Reactive two-component hotmelt adhesive composition Grant 9,487,686 - Butterbach , et al. November 8, 2 | 2016-11-08 |
Hot Melt Adhesive Containing A Polyamide/ Polyolefin Hybrid Polymer App 20150337186 - MARCHESE; Luca ;   et al. | 2015-11-26 |
Reactive Two-component Hotmelt Adhesive Composition App 20140287173 - Butterbach; Ruediger ;   et al. | 2014-09-25 |
Water-swellable hot-melt-type adhesive Grant 6,803,400 - Butterbach , et al. October 12, 2 | 2004-10-12 |
Hot-melt adhesive for glueing DVDs Grant 6,767,424 - Butterbach , et al. July 27, 2 | 2004-07-27 |
Swellable hotmelt adhesive Grant 6,677,394 - Butterbach , et al. January 13, 2 | 2004-01-13 |
Hot-melt adhesive for gluing digital versatile discs Grant 6,228,456 - Butterbach , et al. May 8, 2 | 2001-05-08 |
Thermoplastic hotmelt adhesive Grant 5,512,625 - Butterbach , et al. April 30, 1 | 1996-04-30 |
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