Butt; Sheldon H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Butt; Sheldon H..The latest application filed is for "electronic packaging of components incorporating a ceramic-glass-metal composite".
- Butt; Sheldon H. - Godfrey IL
| Patent | Date |
|---|---|
| Electronic packaging of components incorporating a ceramic-glass-metal composite Grant 5,024,883 - SinghDeo , et al. June 18, 1 | 1991-06-18 |
| Semiconductor package Grant 5,014,159 - Butt May 7, 1 | 1991-05-07 |
| Clad metal lead frame substrates Grant 5,001,546 - Butt March 19, 1 | 1991-03-19 |
| Hermetic microminiature packages Grant 4,967,260 - Butt October 30, 1 | 1990-10-30 |
| Metal packages having improved thermal dissipation Grant 4,961,106 - Butt , et al. October 2, 1 | 1990-10-02 |
| Metal electronic package Grant 4,897,508 - Mahulikar , et al. January 30, 1 | 1990-01-30 |
| Semiconductor package Grant 4,888,449 - Crane , et al. December 19, 1 | 1989-12-19 |
| Electronic packaging of components incorporating a ceramic-glass-metal composite Grant 4,882,212 - SinghDeo , et al. November 21, 1 | 1989-11-21 |
| Chip carrier Grant 4,862,323 - Butt August 29, 1 | 1989-08-29 |
| Printed circuit board Grant 4,851,615 - Butt July 25, 1 | 1989-07-25 |
| Heat dissipating interconnect tape for use in tape automated bonding Grant 4,849,857 - Butt , et al. July 18, 1 | 1989-07-18 |
| Semiconductor packaging Grant 4,839,716 - Butt June 13, 1 | 1989-06-13 |
| Multi-layer circuitry Grant 4,827,377 - Butt May 2, 1 | 1989-05-02 |
| Hermetically sealed semiconductor package Grant 4,805,009 - Pryor , et al. February 14, 1 | 1989-02-14 |
| Semiconductor casing Grant 4,796,083 - Cherukuri , et al. January 3, 1 | 1989-01-03 |
| Method of making a hermetically sealed semiconductor casing Grant 4,784,974 - Butt November 15, 1 | 1988-11-15 |
| Process for producing a hermetically sealed package for an electrical component containing a low amount of oxygen and water vapor Grant 4,769,345 - Butt , et al. September 6, 1 | 1988-09-06 |
| Special surfaces for wire bonding Grant 4,767,049 - Butt , et al. August 30, 1 | 1988-08-30 |
| Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs Grant 4,761,518 - Butt , et al. August 2, 1 | 1988-08-02 |
| Tape bonding material and structure for electronic circuit fabrication Grant 4,736,236 - Butt April 5, 1 | 1988-04-05 |
| Multi-layer circuitry Grant 4,682,414 - Butt July 28, 1 | 1987-07-28 |
| Method of making low thermal expansivity and high thermal conductivity substrate Grant 4,659,404 - Butt April 21, 1 | 1987-04-21 |
| Hermetically sealed semiconductor casing Grant 4,656,499 - Butt April 7, 1 | 1987-04-07 |
| Plasma deposition applications for communication cables Grant 4,652,323 - Butt March 24, 1 | 1987-03-24 |
| Tape packages Grant 4,607,276 - Butt August 19, 1 | 1986-08-19 |
| Method of making semiconductor casing Grant 4,594,770 - Butt June 17, 1 | 1986-06-17 |
| Adhesion primers for encapsulating epoxies Grant 4,582,556 - Butt , et al. April 15, 1 | 1986-04-15 |
| Hermetically sealed metal package Grant 4,577,056 - Butt March 18, 1 | 1986-03-18 |
| Method of assembling a chip carrier Grant 4,570,337 - Butt February 18, 1 | 1986-02-18 |
| Low thermal expansivity and high thermal conductivity substrate Grant 4,569,692 - Butt February 11, 1 | 1986-02-11 |
| High density packages Grant 4,542,259 - Butt September 17, 1 | 1985-09-17 |
| Reinforced glass composites Grant 4,532,222 - Butt July 30, 1 | 1985-07-30 |
| Adhesion primers for encapsulating epoxies Grant 4,525,422 - Butt , et al. June 25, 1 | 1985-06-25 |
| Semiconductor packages Grant 4,524,238 - Butt June 18, 1 | 1985-06-18 |
| Casing for electronic components Grant 4,521,469 - Butt , et al. June 4, 1 | 1985-06-04 |
| Composites of glass-ceramic to metal seals and method of making the same Grant 4,491,622 - Butt January 1, 1 | 1985-01-01 |
| Semiconductor casing Grant 4,480,262 - Butt October 30, 1 | 1984-10-30 |
| Semiconductor casing Grant 4,461,924 - Butt July 24, 1 | 1984-07-24 |
| Casing for an electrical component having improved strength and heat transfer characteristics Grant 4,410,927 - Butt October 18, 1 | 1983-10-18 |
| Three tube heat exchanger panel Grant D265,584 - Butt , et al. July 27, 1 | 1982-07-27 |
| Catalyst for the diminution of automobile exhaust gases Grant 3,944,504 - Ford , et al. March 16, 1 | 1976-03-16 |
| Catalyst for the reduction of automobile exhaust gases Grant 3,876,456 - Ford , et al. April 8, 1 | 1975-04-08 |
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