Bush; Kendall

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bush; Kendall.The latest application filed is for "polymeric nonwoven structure for use in high temperature applications".

Company Profile

8.4.13

Bush; Kendall - Macomb MI
Bush; Kendall - Austin TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
Polymeric Nonwoven Structure For Use In High Temperature Applications App 20220219425 - Bush; Kendall	2022-07-14
Cushioning Flooring Underlayment App 20220105701 - Mohan; Varun ; et al.	2022-04-07
Polymeric nonwoven structure for use in high temperature applications Grant 11,292,226 - Bush April 5, 2	2022-04-05
Functional Nonwoven Scrim For High Temperature Applications Requiring Low Flammability, Smoke, And Toxicity App 20210301436 - Thompson; Greg ; et al.	2021-09-30
Functional Insert For Nonwoven Materials App 20210146287 - Thompson; Greg ; et al.	2021-05-20
Femtocell Provisioning And Service Issue Optimization App 20210037395 - Veggalam; Vijay ; et al.	2021-02-04
Polymeric Nonwoven Structure For Use In High Temperature Applications App 20200331230 - Bush; Kendall	2020-10-22
Femtocell provisioning and service issue optimization Grant 10,805,809 - Veggalam , et al. October 13, 2	2020-10-13
Aluminized faced nonwoven materials Grant 10,755,686 - Bush A	2020-08-25
Nonwoven Composite For High Temperature Applications Requiring Low Flammability, Smoke, And Toxicity App 20200232133 - Bush; Kendall ; et al.	2020-07-23
Acoustic floor underlay system Grant 10,460,715 - Bush , et al. Oc	2019-10-29
Insulation For Modular Buildings App 20180339491 - Hursit; Eren ; et al.	2018-11-29
Multi-impedance Composite App 20180126691 - Bush; Kendall ; et al.	2018-05-10
Nonwoven Infrared Reflective Fiber Materials App 20180047380 - Bush; Kendall	2018-02-15
Aluminized Faced Nonwoven Materials App 20180005620 - Bush; Kendall	2018-01-04
Acoustic Floor Underlay System App 20170372688 - Bush; Kendall ; et al.	2017-12-28
High Temperature Moldable Pressure Sensitive Adhesive System App 20170088750 - Bush; Kendall	2017-03-30

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