Buschhardt; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Buschhardt; Thomas.The latest application filed is for "separating apparatus for polysilicon".

Company Profile

1.20.20

Buschhardt; Thomas - Burghausen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Separating apparatus for polysilicon Grant 11,154,908 - Buschhardt , et al. October 26, 2	2021-10-26
Screen plate for screening plants for mechanical classification of polysilicon Grant 11,059,072 - Bergmann , et al. July 13, 2	2021-07-13
Separating Apparatus For Polysilicon App 20200086348 - BUSCHHARDT; Thomas ; et al.	2020-03-19
Screen Plate For Screening Plants For Mechanical Classification Of Polysilicon App 20180185882 - BERGMANN; Andreas ; et al.	2018-07-05
Process for cleaning, drying and hydrophilizing a semiconductor wafer Grant 9,230,794 - Schwab , et al. January 5, 2	2016-01-05
Method for the double-side polishing of a semiconductor wafer Grant 8,721,390 - Schwandner , et al. May 13, 2	2014-05-13
Method for producing a semiconductor wafer Grant 8,685,270 - Schwandner , et al. April 1, 2	2014-04-01
Method for polishing a semiconductor wafer Grant 8,647,173 - Schwandner , et al. February 11, 2	2014-02-11
Method for polishing a substrate composed of semiconductor material Grant 8,647,985 - Schwandner , et al. February 11, 2	2014-02-11
Method for the treatment of a semiconductor wafer Grant 8,580,046 - Schwab , et al. November 12, 2	2013-11-12
Method For Polishing A Semiconductor Wafer App 20130189904 - Schwandner; Juergen ; et al.	2013-07-25
Method For The Treatment Of A Semiconductor Wafer App 20130068262 - Schwab; Guenter ; et al.	2013-03-21
Method for the treatment of a semiconductor wafer Grant 8,372,213 - Schwab , et al. February 12, 2	2013-02-12
Process Module for the Inline-Treatment of Substrates App 20120248068 - Schienle; Frank ; et al.	2012-10-04
Method for producing a wafer comprising a silicon single crystal substrate having a front and a back side and a layer of SiGe deposited on the front side Grant 8,093,143 - Storck , et al. January 10, 2	2012-01-10
Method for the wet-chemical treatment of a semiconductor wafer Grant 8,070,882 - Schwab , et al. December 6, 2	2011-12-06
Method For The Double-side Polishing Of A Semiconductor Wafer App 20110244762 - Schwandner; Juergen ; et al.	2011-10-06
Process for cleaning a semiconductor wafer using a cleaning solution Grant 7,938,911 - Zapilko , et al. May 10, 2	2011-05-10
Method For Polishing A Semiconductor Wafer App 20110097974 - SCHWANDNER; Juergen ; et al.	2011-04-28
Method For Producing A Semiconductor Wafer App 20110097975 - SCHWANDNER; Juergen ; et al.	2011-04-28
Method For Producing A Wafer Comprising A Silicon Single Crystal Substrate Having A Front And A Back Side And A Layer of SiGe Deposited On The Front Side App 20100291761 - Storck; Peter ; et al.	2010-11-18
Method For The Treatment Of A Semiconductor Wafer App 20100139706 - Schwab; Guenter ; et al.	2010-06-10
Method For The Wet-Chemical Treatment Of A Semiconductor Wafer App 20090145457 - Schwab; Guenter ; et al.	2009-06-11
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method Grant 7,541,287 - Schmolke , et al. June 2, 2	2009-06-02
Method for producing a layer structure Grant 7,538,008 - Feijoo , et al. May 26, 2	2009-05-26
Process For Cleaning A Semiconductor Wafer App 20090071507 - Buschhardt; Thomas ; et al.	2009-03-19
Method For Polishing A Substrate Composed Of Semiconductor Material App 20090029552 - Schwandner; Juergen ; et al.	2009-01-29
Process For Cleaning A Semiconductor Wafer Using A Cleaning Solution App 20090007940 - Zapilko; Clemens ; et al.	2009-01-08
Process For Cleaning, Drying and Hydrophilizing A Semiconductor Wafer App 20080308122 - Schwab; Guenter ; et al.	2008-12-18
Methods for the single-sided polishing of semiconductor wafers and semiconductor wafer having a relaxed Si1-x GEx Layer App 20080265375 - Pietsch; Georg ; et al.	2008-10-30
Method For Producing A Layer Structure App 20070259530 - Feijoo; Diego ; et al.	2007-11-08
Method for machining a semiconductor wafer on both sides in a carrier, carrier, and a semiconductor wafer produced by the method App 20070021042 - Schmolke; Ruediger ; et al.	2007-01-25
Process For Treating A Polished Semiconductor Water Immediately After The Semiconductor Wafer Has Been Polished App 20020187639 - HENNHOFER, HEINRICH ; et al.	2002-12-12
Process for the surface polishing of silicon wafers App 20020077039 - Wenski, Guido ; et al.	2002-06-20
Process and device for polishing semiconductor wafers Grant 6,095,898 - Hennhofer , et al. August 1, 2	2000-08-01

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