Busch; Joerg

Patent Applications and Registrations

Patent applications and USPTO patent grants for Busch; Joerg.The latest application filed is for "barrier for power metallization in semiconductor devices".

Company Profile

2.6.6

Busch; Joerg - Regensburg DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Barrier for power metallization in semiconductor devices Grant 11,127,693 - Gatterbauer , et al. September 21, 2	2021-09-21
Method for stabilizing a semiconductor arrangement Grant 11,081,384 - Gruber , et al. August 3, 2	2021-08-03
Barrier for Power Metallization in Semiconductor Devices App 20200111754 - Gatterbauer; Johann ; et al.	2020-04-09
Method for Stabilizing a Semiconductor Arrangement App 20190326155 - Gruber; Hermann ; et al.	2019-10-24
Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement Grant 8,765,531 - Gatterbauer , et al. July 1, 2	2014-07-01
Method For Manufacturing A Metal Pad Structure Of A Die, A Method For Manufacturing A Bond Pad Of A Chip, A Die Arrangement And A Chip Arrangement App 20140054800 - Gatterbauer; Johann ; et al.	2014-02-27
Metallization layer for a power semiconductor device Grant 7,737,560 - Stecher , et al. June 15, 2	2010-06-15
Metallization layer for a power semiconductor device App 20070267749 - Stecher; Matthias ; et al.	2007-11-22
Semiconductor component and method for fabricating Grant 7,276,803 - Stecher , et al. October 2, 2	2007-10-02
Semiconductor component and method for fabricating App 20050127534 - Stecher, Matthias ; et al.	2005-06-16

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