Burns; Carmen D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Burns; Carmen D..The latest application filed is for "high density integrated circuit module".

Company Profile

0.70.4

Burns; Carmen D. - Austin TX
Burns; Carmen D. - San Jose CA
Burns; Carmen D. - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Flexible circuit connector for stacked chip module Grant 7,066,741 - Burns , et al. June 27, 2	2006-06-27
High density integrated circuit module Grant 6,919,626 - Burns July 19, 2	2005-07-19
High density integrated circuit module App 20050139980 - Burns, Carmen D.	2005-06-30
Flexible circuit connector for stacked chip module App 20030203663 - Burns, Carmen D. ; et al.	2003-10-30
Stacking system and method Grant 6,608,763 - Burns , et al. August 19, 2	2003-08-19
Flexible circuit connector for stacked chip module Grant 6,572,387 - Burns , et al. June 3, 2	2003-06-03
Flexible circuit connector for stacked chip module App 20020102870 - Burns, Carmen D. ; et al.	2002-08-01
Stacked micro ball grid array packages Grant 6,310,392 - Burns October 30, 2	2001-10-30
High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief Grant 6,288,907 - Burns September 11, 2	2001-09-11
Method of manufacturing a surface mount package App 20010005042 - Burns, Carmen D.	2001-06-28
Method of manufacturing a surface mount package Grant 6,205,654 - Burns March 27, 2	2001-03-27
Warp-resistent ultra-thin integrated circuit package fabrication method Grant 6,194,247 - Burns , et al. February 27, 2	2001-02-27
Method of manufacturing a warp resistant thermally conductive circuit package Grant 6,190,939 - Burns February 20, 2	2001-02-20
Ultra high density integrated circuit packages Grant 6,168,970 - Burns January 2, 2	2001-01-02
Ultra high density integrated circuit packages Grant 6,049,123 - Burns April 11, 2	2000-04-11
Ultra high density integrated circuit packages Grant 6,025,642 - Burns February 15, 2	2000-02-15
Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends Grant 5,978,227 - Burns November 2, 1	1999-11-02
Method of making high density integrated circuit module Grant 5,960,539 - Burns October 5, 1	1999-10-05
Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package Grant 5,945,732 - Burns August 31, 1	1999-08-31
Three-dimensional warp-resistant integrated circuit module method and apparatus Grant 5,895,232 - Burns April 20, 1	1999-04-20
Wrap-resistant ultra-thin integrated circuit package fabrication method Grant 5,864,175 - Burns January 26, 1	1999-01-26
Method of manufacturing an ultra-high density warp-resistant memory module Grant 5,843,807 - Burns December 1, 1	1998-12-01
Ultra-high density warp-resistant memory module Grant 5,828,125 - Burns October 27, 1	1998-10-27
Hermetically sealed integrated circuit lead-on package configuration Grant 5,804,870 - Burns September 8, 1	1998-09-08
Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief Grant 5,778,522 - Burns July 14, 1	1998-07-14
Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method Grant 5,702,985 - Burns December 30, 1	1997-12-30
Lead-on-chip integrated circuit apparatus Grant 5,654,877 - Burns August 5, 1	1997-08-05
Ultra-high density warp-resistant memory module Grant 5,644,161 - Burns July 1, 1	1997-07-01
High density lead-on-package fabrication method Grant 5,631,193 - Burns May 20, 1	1997-05-20
Method of manufacturing an integrated package having a pair of die on a common lead frame Grant 5,615,475 - Burns April 1, 1	1997-04-01
Method of manufacturing a bus communication system for stacked high density integrated circuit packages Grant 5,605,592 - Burns February 25, 1	1997-02-25
Integrated circuit package with overlapped die on a common lead frame Grant 5,585,668 - Burns December 17, 1	1996-12-17
Bus communication system for stacked high density integrated circuit packages Grant 5,586,009 - Burns December 17, 1	1996-12-17
Warp-resistant ultra-thin integrated circuit package Grant 5,581,121 - Burns , et al. December 3, 1	1996-12-03
Hermetically sealed ceramic integrated circuit heat dissipating package Grant 5,572,065 - Burns November 5, 1	1996-11-05
Ultra high density integrated circuit packages method and apparatus Grant 5,566,051 - Burns October 15, 1	1996-10-15
Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package Grant 5,561,591 - Burns October 1, 1	1996-10-01
Bus communication system for stacked high density integrated circuit packages Grant 5,552,963 - Burns September 3, 1	1996-09-03
Ultra high density integrated circuit packages Grant 5,550,711 - Burns , et al. August 27, 1	1996-08-27
Ultra high density integrated circuit package Grant 5,543,664 - Burns August 6, 1	1996-08-06
Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame Grant 5,541,812 - Burns July 30, 1	1996-07-30
Lead-on-chip integrated circuit apparatus Grant 5,528,075 - Burns June 18, 1	1996-06-18
Capacitive coupling configuration for an intergrated circuit package Grant 5,498,906 - Roane , et al. March 12, 1	1996-03-12
High density integrated circuit module with snap-on rail assemblies Grant 5,499,160 - Burns March 12, 1	1996-03-12
Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends Grant 5,493,476 - Burns February 20, 1	1996-02-20
High density lead-on-package fabrication method and apparatus Grant 5,484,959 - Burns January 16, 1	1996-01-16
Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends Grant 5,479,318 - Burns December 26, 1	1995-12-26
Method of assembling ultra high density integrated circuit packages Grant 5,475,920 - Burns , et al. December 19, 1	1995-12-19
Bus communication system for stacked high density integrated circuit packages Grant 5,455,740 - Burns October 3, 1	1995-10-03
Ultra high density integrated circuit packages Grant 5,446,620 - Burns , et al. August 29, 1	1995-08-29
Ultra high density modular integrated circuit package Grant 5,420,751 - Burns May 30, 1	1995-05-30
Ultra high density integrated circuit packages method and apparatus Grant 5,377,077 - Burns December 27, 1	1994-12-27
Ultra high density integrated circuit packages method Grant 5,367,766 - Burns , et al. November 29, 1	1994-11-29
Warp-resistent ultra-thin integrated circuit package fabrication method Grant 5,369,056 - Burns , et al. November 29, 1	1994-11-29
Ultra high density integrated circuit packages method Grant 5,279,029 - Burns January 18, 1	1994-01-18
Impact solder method and apparatus Grant 5,236,117 - Roane , et al. August 17, 1	1993-08-17
Lead-on-chip integrated circuit fabrication method Grant 5,221,642 - Burns June 22, 1	1993-06-22
Controlled collapse thermocompression gang bonding Grant 4,754,912 - Burns July 5, 1	1988-07-05
Stabilization of semiconductor device package leads Grant 4,482,781 - Burns November 13, 1	1984-11-13
Assembly tape for hermetic tape packaging semiconductor devices Grant 4,470,507 - Burns September 11, 1	1984-09-11
Integrated circuit packaging process Grant 4,466,183 - Burns August 21, 1	1984-08-21
Process for manufacturing a tear strip planarization ring for gang bonded semiconductor device interconnect tape Grant 4,413,404 - Burns * November 8, 1	1983-11-08
Process for hermetically encapsulating semiconductor devices Grant 4,355,463 - Burns October 26, 1	1982-10-26
Gang bonding interconnect tape process and structure for semiconductor device automatic assembly Grant 4,331,740 - Burns May 25, 1	1982-05-25
Tape operated semiconductor device packaging Grant 4,330,790 - Burns May 18, 1	1982-05-18
Tear strip planarization ring for gang bonded semiconductor device interconnect tape Grant 4,312,926 - Burns January 26, 1	1982-01-26
Apparatus and process for laminating composite tape Grant 4,295,912 - Burns October 20, 1	1981-10-20
Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices Grant 4,209,355 - Burns June 24, 1	1980-06-24
Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices Grant 4,188,438 - Burns February 12, 1	1980-02-12
Apparatus for and method of shaping interconnect leads Grant 4,099,660 - Schultz , et al. July 11, 1	1978-07-11
Method of making gang bonding interconnect tape for semiconductive devices Grant 4,063,993 - Burns December 20, 1	1977-12-20
Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices Grant 4,000,842 - Burns January 4, 1	1977-01-04
Liquid Crystal Display Panel Grant 3,771,855 - Burns November 13, 1	1973-11-13
Step And Repeat Photomask And Method Of Using Same Grant 3,647,445 - Burns March 7, 1	1972-03-07

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