Patent | Date |
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Flexible circuit connector for stacked chip module Grant 7,066,741 - Burns , et al. June 27, 2 | 2006-06-27 |
High density integrated circuit module Grant 6,919,626 - Burns July 19, 2 | 2005-07-19 |
High density integrated circuit module App 20050139980 - Burns, Carmen D. | 2005-06-30 |
Flexible circuit connector for stacked chip module App 20030203663 - Burns, Carmen D. ;   et al. | 2003-10-30 |
Stacking system and method Grant 6,608,763 - Burns , et al. August 19, 2 | 2003-08-19 |
Flexible circuit connector for stacked chip module Grant 6,572,387 - Burns , et al. June 3, 2 | 2003-06-03 |
Flexible circuit connector for stacked chip module App 20020102870 - Burns, Carmen D. ;   et al. | 2002-08-01 |
Stacked micro ball grid array packages Grant 6,310,392 - Burns October 30, 2 | 2001-10-30 |
High density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief Grant 6,288,907 - Burns September 11, 2 | 2001-09-11 |
Method of manufacturing a surface mount package App 20010005042 - Burns, Carmen D. | 2001-06-28 |
Method of manufacturing a surface mount package Grant 6,205,654 - Burns March 27, 2 | 2001-03-27 |
Warp-resistent ultra-thin integrated circuit package fabrication method Grant 6,194,247 - Burns , et al. February 27, 2 | 2001-02-27 |
Method of manufacturing a warp resistant thermally conductive circuit package Grant 6,190,939 - Burns February 20, 2 | 2001-02-20 |
Ultra high density integrated circuit packages Grant 6,168,970 - Burns January 2, 2 | 2001-01-02 |
Ultra high density integrated circuit packages Grant 6,049,123 - Burns April 11, 2 | 2000-04-11 |
Ultra high density integrated circuit packages Grant 6,025,642 - Burns February 15, 2 | 2000-02-15 |
Integrated circuit packages having an externally mounted lead frame having bifurcated distal lead ends Grant 5,978,227 - Burns November 2, 1 | 1999-11-02 |
Method of making high density integrated circuit module Grant 5,960,539 - Burns October 5, 1 | 1999-10-05 |
Apparatus and method of manufacturing a warp resistant thermally conductive integrated circuit package Grant 5,945,732 - Burns August 31, 1 | 1999-08-31 |
Three-dimensional warp-resistant integrated circuit module method and apparatus Grant 5,895,232 - Burns April 20, 1 | 1999-04-20 |
Wrap-resistant ultra-thin integrated circuit package fabrication method Grant 5,864,175 - Burns January 26, 1 | 1999-01-26 |
Method of manufacturing an ultra-high density warp-resistant memory module Grant 5,843,807 - Burns December 1, 1 | 1998-12-01 |
Ultra-high density warp-resistant memory module Grant 5,828,125 - Burns October 27, 1 | 1998-10-27 |
Hermetically sealed integrated circuit lead-on package configuration Grant 5,804,870 - Burns September 8, 1 | 1998-09-08 |
Method of manufacturing a high density integrated circuit module with complex electrical interconnect rails having electrical interconnect strain relief Grant 5,778,522 - Burns July 14, 1 | 1998-07-14 |
Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method Grant 5,702,985 - Burns December 30, 1 | 1997-12-30 |
Lead-on-chip integrated circuit apparatus Grant 5,654,877 - Burns August 5, 1 | 1997-08-05 |
Ultra-high density warp-resistant memory module Grant 5,644,161 - Burns July 1, 1 | 1997-07-01 |
High density lead-on-package fabrication method Grant 5,631,193 - Burns May 20, 1 | 1997-05-20 |
Method of manufacturing an integrated package having a pair of die on a common lead frame Grant 5,615,475 - Burns April 1, 1 | 1997-04-01 |
Method of manufacturing a bus communication system for stacked high density integrated circuit packages Grant 5,605,592 - Burns February 25, 1 | 1997-02-25 |
Integrated circuit package with overlapped die on a common lead frame Grant 5,585,668 - Burns December 17, 1 | 1996-12-17 |
Bus communication system for stacked high density integrated circuit packages Grant 5,586,009 - Burns December 17, 1 | 1996-12-17 |
Warp-resistant ultra-thin integrated circuit package Grant 5,581,121 - Burns , et al. December 3, 1 | 1996-12-03 |
Hermetically sealed ceramic integrated circuit heat dissipating package Grant 5,572,065 - Burns November 5, 1 | 1996-11-05 |
Ultra high density integrated circuit packages method and apparatus Grant 5,566,051 - Burns October 15, 1 | 1996-10-15 |
Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package Grant 5,561,591 - Burns October 1, 1 | 1996-10-01 |
Bus communication system for stacked high density integrated circuit packages Grant 5,552,963 - Burns September 3, 1 | 1996-09-03 |
Ultra high density integrated circuit packages Grant 5,550,711 - Burns , et al. August 27, 1 | 1996-08-27 |
Ultra high density integrated circuit package Grant 5,543,664 - Burns August 6, 1 | 1996-08-06 |
Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame Grant 5,541,812 - Burns July 30, 1 | 1996-07-30 |
Lead-on-chip integrated circuit apparatus Grant 5,528,075 - Burns June 18, 1 | 1996-06-18 |
Capacitive coupling configuration for an intergrated circuit package Grant 5,498,906 - Roane , et al. March 12, 1 | 1996-03-12 |
High density integrated circuit module with snap-on rail assemblies Grant 5,499,160 - Burns March 12, 1 | 1996-03-12 |
Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends Grant 5,493,476 - Burns February 20, 1 | 1996-02-20 |
High density lead-on-package fabrication method and apparatus Grant 5,484,959 - Burns January 16, 1 | 1996-01-16 |
Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends Grant 5,479,318 - Burns December 26, 1 | 1995-12-26 |
Method of assembling ultra high density integrated circuit packages Grant 5,475,920 - Burns , et al. December 19, 1 | 1995-12-19 |
Bus communication system for stacked high density integrated circuit packages Grant 5,455,740 - Burns October 3, 1 | 1995-10-03 |
Ultra high density integrated circuit packages Grant 5,446,620 - Burns , et al. August 29, 1 | 1995-08-29 |
Ultra high density modular integrated circuit package Grant 5,420,751 - Burns May 30, 1 | 1995-05-30 |
Ultra high density integrated circuit packages method and apparatus Grant 5,377,077 - Burns December 27, 1 | 1994-12-27 |
Ultra high density integrated circuit packages method Grant 5,367,766 - Burns , et al. November 29, 1 | 1994-11-29 |
Warp-resistent ultra-thin integrated circuit package fabrication method Grant 5,369,056 - Burns , et al. November 29, 1 | 1994-11-29 |
Ultra high density integrated circuit packages method Grant 5,279,029 - Burns January 18, 1 | 1994-01-18 |
Impact solder method and apparatus Grant 5,236,117 - Roane , et al. August 17, 1 | 1993-08-17 |
Lead-on-chip integrated circuit fabrication method Grant 5,221,642 - Burns June 22, 1 | 1993-06-22 |
Controlled collapse thermocompression gang bonding Grant 4,754,912 - Burns July 5, 1 | 1988-07-05 |
Stabilization of semiconductor device package leads Grant 4,482,781 - Burns November 13, 1 | 1984-11-13 |
Assembly tape for hermetic tape packaging semiconductor devices Grant 4,470,507 - Burns September 11, 1 | 1984-09-11 |
Integrated circuit packaging process Grant 4,466,183 - Burns August 21, 1 | 1984-08-21 |
Process for manufacturing a tear strip planarization ring for gang bonded semiconductor device interconnect tape Grant 4,413,404 - Burns * November 8, 1 | 1983-11-08 |
Process for hermetically encapsulating semiconductor devices Grant 4,355,463 - Burns October 26, 1 | 1982-10-26 |
Gang bonding interconnect tape process and structure for semiconductor device automatic assembly Grant 4,331,740 - Burns May 25, 1 | 1982-05-25 |
Tape operated semiconductor device packaging Grant 4,330,790 - Burns May 18, 1 | 1982-05-18 |
Tear strip planarization ring for gang bonded semiconductor device interconnect tape Grant 4,312,926 - Burns January 26, 1 | 1982-01-26 |
Apparatus and process for laminating composite tape Grant 4,295,912 - Burns October 20, 1 | 1981-10-20 |
Manufacture of bumped composite tape for automatic gang bonding of semiconductor devices Grant 4,209,355 - Burns June 24, 1 | 1980-06-24 |
Antioxidant coating of copper parts for thermal compression gang bonding of semiconductive devices Grant 4,188,438 - Burns February 12, 1 | 1980-02-12 |
Apparatus for and method of shaping interconnect leads Grant 4,099,660 - Schultz , et al. July 11, 1 | 1978-07-11 |
Method of making gang bonding interconnect tape for semiconductive devices Grant 4,063,993 - Burns December 20, 1 | 1977-12-20 |
Copper-to-gold thermal compression gang bonding of interconnect leads to semiconductive devices Grant 4,000,842 - Burns January 4, 1 | 1977-01-04 |
Liquid Crystal Display Panel Grant 3,771,855 - Burns November 13, 1 | 1973-11-13 |
Step And Repeat Photomask And Method Of Using Same Grant 3,647,445 - Burns March 7, 1 | 1972-03-07 |