Burke; David Oliver
Patent Applications and Registrations
Patent applications and USPTO patent grants for Burke; David Oliver.The latest application filed is for "printhead module having alternate longitudinal ink supply channels and slots".
Company Profile
8.16.23
- Burke; David Oliver - North Ryde AU
- BURKE; David Oliver - North Ryde NSW AU
- Burke; David Oliver - Balmain N/A AU
Patent Activity
| Patent | Date |
|---|---|
| Printing unit with replaceable printhead Grant 11,453,228 - Profaca , et al. September 27, 2 | 2022-09-27 |
| Redundant full color pagewide printhead having narrow print zone Grant 11,433,673 - Thelander , et al. September 6, 2 | 2022-09-06 |
| Printhead Module Having Alternate Longitudinal Ink Supply Channels And Slots App 20220266594 - THELANDER; Jason Mark ; et al. | 2022-08-25 |
| Nested printhead modules having closely spaced print chips Grant 11,390,082 - Thelander , et al. July 19, 2 | 2022-07-19 |
| Ink and power arrangement for modular inkjet printhead Grant 11,390,083 - Thelander , et al. July 19, 2 | 2022-07-19 |
| Printhead module having through-slots for supplying power and data Grant 11,358,391 - Thelander , et al. June 14, 2 | 2022-06-14 |
| Electrical arrangement for printhead modules having multiple rows of print chips Grant 11,351,786 - Thelander , et al. June 7, 2 | 2022-06-07 |
| Modular inkjet printhead for redundant pagewide printing Grant 11,351,785 - Thelander , et al. June 7, 2 | 2022-06-07 |
| Modular inkjet printhead having printhead modules with overlapping ink ports Grant 11,318,746 - Thelander , et al. May 3, 2 | 2022-05-03 |
| Electrical Arrangement For Printhead Modules Having Multiple Rows Of Print Chips App 20210078329 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Modular Inkjet Printhead For Redundant Pagewide Printing App 20210078324 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Printhead Module Having Through-slots For Supplying Power And Data App 20210078326 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Redundant Full Color Pagewide Printhead Having Narrow Print Zone App 20210078327 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Modular Inkjet Printhead Having Printhead Modules With Overlapping Ink Ports App 20210078328 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Nested Printhead Modules Having Closely Spaced Print Chips App 20210078325 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Ink And Power Arrangement For Modular Inkjet Printhead App 20210078322 - Thelander; Jason Mark ; et al. | 2021-03-18 |
| Printing Unit With Replaceable Printhead App 20210046773 - PROFACA; Mark ; et al. | 2021-02-18 |
| Placement head for a die placing assembly Grant 8,701,276 - Burke , et al. April 22, 2 | 2014-04-22 |
| Wafer positioning system Grant 8,296,937 - Burke , et al. October 30, 2 | 2012-10-30 |
| Integrated circuit placement system Grant 8,092,625 - Burke , et al. January 10, 2 | 2012-01-10 |
| Clamp assembly for an assembler of integrated circuitry on a carrier Grant 7,979,979 - Burke , et al. July 19, 2 | 2011-07-19 |
| Method of attaching integrated circuits to a carrier Grant 7,877,876 - Burke , et al. February 1, 2 | 2011-02-01 |
| Transfer apparatus for transferring a component of integrated circuitry Grant 7,805,832 - Burke , et al. October 5, 2 | 2010-10-05 |
| Test stage for a carrier having printhead integrated circuitry thereon Grant 7,786,723 - Burke , et al. August 31, 2 | 2010-08-31 |
| Alignment Mechanism For Aligning An Integrated Circuit App 20100043980 - Sleijpen; Stephen John ; et al. | 2010-02-25 |
| Clamp Assembly For An Assembler For Assembling Printhead Integrated Circuitry On A Carrier App 20100043215 - Burke; David Oliver ; et al. | 2010-02-25 |
| Transfer Apparatus For Transferring A Component Of Integrated Circuitry App 20100043213 - Burke; David Oliver ; et al. | 2010-02-25 |
| Bonding Apparatus For Printheads App 20100043979 - Sleijpen; Stephen John ; et al. | 2010-02-25 |
| Integrated Circuit Dice Pick And Lift Head App 20100043214 - Burke; David Oliver ; et al. | 2010-02-25 |
| Laminating Apparatus For A Printhead Carrier Sub-assembly App 20100043977 - Sleijpen; Stephen John ; et al. | 2010-02-25 |
| Method For Laminating A Carrier For Printhead Integrated Circuitry App 20100043960 - Sleijpen; Stephen John ; et al. | 2010-02-25 |
| Wafer positioning system App 20100047052 - Burke; David Oliver ; et al. | 2010-02-25 |
| Placement Head For A Die Placing Assembly App 20100047044 - Burke; David Oliver ; et al. | 2010-02-25 |
| Multi-chip Printhead Assembler App 20100047962 - Burke; David Oliver ; et al. | 2010-02-25 |
| Die Picker For Picking Printhead Die From A Wafer App 20100047053 - Burke; David Oliver ; et al. | 2010-02-25 |
| Integrated Circuit Placement System App 20100047043 - Burke; David Oliver ; et al. | 2010-02-25 |
| Test Stage For A Carrier Having Printhead Integrated Circuitry Thereon App 20100045314 - Burke; David Oliver ; et al. | 2010-02-25 |
| Method Of Attaching Integrated Circuits To A Carrier App 20100043224 - Burke; David Oliver ; et al. | 2010-02-25 |
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