Burger; Wayne R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Burger; Wayne R..The latest application filed is for "monolithic microwave integrated circuits".

Company Profile

0.16.13

Burger; Wayne R. - Phoenix AZ
Burger; Wayne R. - Belmont MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Monolithic microwave integrated circuits Grant 9,871,008 - Sanders , et al. January 16, 2	2018-01-16
Monolithic Microwave Integrated Circuits App 20170077051 - Sanders; Paul W. ; et al.	2017-03-16
Trenched Faraday shielding Grant 9,520,367 - Gao , et al. December 13, 2	2016-12-13
Methods of making a monolithic microwave integrated circuit Grant 9,508,599 - Sanders , et al. November 29, 2	2016-11-29
Trenched Faraday Shielding App 20160056114 - Gao; Zihao M. ; et al.	2016-02-25
Methods Of Making A Monolithic Microwave Integrated Circuit App 20150228545 - SANDERS; PAUL W. ; et al.	2015-08-13
Monolithic microwave integrated circuit Grant 9,064,712 - Sanders , et al. June 23, 2	2015-06-23
Integrated circuits including integrated passive devices and methods of manufacture thereof Grant 8,906,773 - Ren , et al. December 9, 2	2014-12-09
Integrated Circuits Including Integrated Passive Devices And Methods Of Manufacture Thereof App 20140159198 - REN; XIAOWEI ; et al.	2014-06-12
Low loss substrate for integrated passive devices Grant 8,283,748 - Ren , et al. October 9, 2	2012-10-09
Electronic elements and devices with trench under bond pad feature Grant 8,134,241 - Jones , et al. March 13, 2	2012-03-13
Monolithic Microwave Integrated Circuit App 20120037969 - Sanders; Paul W. ; et al.	2012-02-16
Low Loss Substrate For Integrated Passive Devices App 20120038023 - Ren; Xiaowei ; et al.	2012-02-16
Low loss substrate for integrated passive devices Grant 8,071,461 - Ren , et al. December 6, 2	2011-12-06
Electronic Elements And Devices With Trench Under Bond Pad Feature App 20110266687 - Jones; Jeffrey K. ; et al.	2011-11-03
Methods for forming an RF device with trench under bond pad feature Grant 7,998,852 - Jones , et al. August 16, 2	2011-08-16
Rf Device And Method With Trench Under Bond Pad Feature App 20100140814 - Jones; Jeffrey K. ; et al.	2010-06-10
Low Loss Substrate For Integrated Passive Devices App 20100140714 - Ren; Xiaowei ; et al.	2010-06-10
RF power transistor device with metal electromigration design and method thereof Grant 7,525,152 - Dragon , et al. April 28, 2	2009-04-28
Rf Power Transistor Device With Metal Electromigration Design And Method Thereof App 20070205506 - Dragon; Christopher P. ; et al.	2007-09-06
High frequency semiconductor device and method of manufacture Grant 6,744,117 - Dragon , et al. June 1, 2	2004-06-01
High frequency semiconductor device and method of manufacture App 20030160324 - Dragon, Christopher P. ; et al.	2003-08-28
Lateral bipolar transistor Grant 5,358,883 - Burger , et al. October 25, 1	1994-10-25
Growth of epitaxial films by chemical vapor deposition utilizing a surface cleaning step immediately before deposition Grant 4,579,609 - Reif , et al. April 1, 1	1986-04-01

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