loadpatents
name:-0.020654916763306
name:-0.0077390670776367
name:-0.0080389976501465
Burch; Richard Patent Filings

Burch; Richard

Patent Applications and Registrations

Patent applications and USPTO patent grants for Burch; Richard.The latest application filed is for "sequenced approach for determining wafer path quality".

Company Profile
6.5.14
  • Burch; Richard - McKinney TX
  • Burch; Richard - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Predicting die susceptible to early lifetime failure
Grant 11,328,108 - Burch , et al. May 10, 2
2022-05-10
Sequenced Approach For Determining Wafer Path Quality
App 20220066410 - Honda; Tomonori ;   et al.
2022-03-03
Pattern-Enhanced Spatial Correlation of Test Structures to Die Level Responses
App 20220043436 - Burch; Richard ;   et al.
2022-02-10
Predicting Equipment Fail Mode from Process Trace
App 20220027230 - Burch; Richard ;   et al.
2022-01-27
Automatic Window Generation for Process Trace
App 20220027248 - Burch; Richard ;   et al.
2022-01-27
Wafer Bin Map Based Root Cause Analysis
App 20210342993 - Honda; Tomonori ;   et al.
2021-11-04
Abnormal Wafer Image Classification
App 20210334608 - Honda; Tomonori ;   et al.
2021-10-28
Predicting Die Susceptible to Early Lifetime Failure
App 20210279388 - Burch; Richard ;   et al.
2021-09-09
Collaborative Learning Model for Semiconductor Applications
App 20210142122 - Honda; Tomonori ;   et al.
2021-05-13
Machine Learning Variable Selection And Root Cause Discovery By Cumulative Prediction
App 20210117861 - Burch; Richard ;   et al.
2021-04-22
Die Level Product Modeling Without Die Level Input Data
App 20210118754 - Burch; Richard ;   et al.
2021-04-22
Anomalous Equipment Trace Detection and Classification
App 20210103489 - Burch; Richard ;   et al.
2021-04-08
Failure detection for wire bonding in semiconductors
Grant 10,656,204 - Stine , et al.
2020-05-19
Failure Detection For Wire Bonding In Semiconductors
App 20190146032 - Stine; Brian ;   et al.
2019-05-16
Advanced manufacturing insight system for semiconductor application
Grant 10,268,562 - Stine , et al.
2019-04-23
Method and system for failure signal detection analysis
Grant 7,415,386 - Burch , et al. August 19, 2
2008-08-19
Method and System for Failure Signal Detention Analysis
App 20070288185 - Burch; Richard ;   et al.
2007-12-13
Extraction method of defect density and size distributions
Grant 7,024,642 - Hess , et al. April 4, 2
2006-04-04
Extraction method of defect density and size distributions
App 20040094762 - Hess, Christopher ;   et al.
2004-05-20

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