Bunyan; Michael H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bunyan; Michael H..The latest application filed is for "pre-applied conductive adhesive for emi shielding".
Company Profile
3.30.30
- Bunyan; Michael H. - Chelmsford MA
- BUNYAN; Michael H. - Newburyport MA
- - Chelmsford MA US
- Bunyan; Michael H. - Derry NH
Patent Activity
| Patent | Date |
|---|---|
| Deflectable conductive gasket with environmental seal Grant 9,635,790 - Coppola , et al. April 25, 2 | 2017-04-25 |
| Pre-applied Conductive Adhesive For Emi Shielding App 20150382479 - BUNYAN; Michael H. ; et al. | 2015-12-31 |
| Electrode assembly for delivering a therapeutic agent into ocular tissue Grant 08923961 - | 2014-12-30 |
| Electrode assembly for delivering a therapeutic agent into ocular tissue Grant 8,923,961 - Singh , et al. December 30, 2 | 2014-12-30 |
| Deflectable Conductive Gasket With Environmental Seal App 20140360772 - Coppola; Stephen J. ; et al. | 2014-12-11 |
| Encapsulated expanded crimped metal mesh for sealing and EMI shielding applications Grant 8,766,108 - Bunyan , et al. July 1, 2 | 2014-07-01 |
| Encapsulated expanded crimped metal mesh for sealing, EMI shielding and lightning strike applications Grant 8,759,692 - Bunyan , et al. June 24, 2 | 2014-06-24 |
| Low force deflection and corrosion resistant EMI gasket Grant 8,633,402 - Bunyan , et al. January 21, 2 | 2014-01-21 |
| Encapsulated Expanded Crimped Metal Mesh For Sealing, Emi Shielding And Lightning Strike Applications App 20130092410 - Bunyan; Michael H. ; et al. | 2013-04-18 |
| Low Force Deflection And Corrosion Resistant Emi Gasket App 20130068519 - Bunyan; Michael H. ; et al. | 2013-03-21 |
| Fully-cured Thermally Or Electrically Conductive Form-in-place Gap Filler App 20120133072 - Bunyan; Michael H. ; et al. | 2012-05-31 |
| Encapsulated Expanded Crimped Metal Mesh For Sealing And Emi Shielding Applications App 20120048612 - Bunyan; Michael H. ; et al. | 2012-03-01 |
| Dispensable cured resin Grant 8,119,191 - Bunyan , et al. February 21, 2 | 2012-02-21 |
| Thermally Conductive Gel Packs App 20110308781 - O'Riordan; Eoin ; et al. | 2011-12-22 |
| Electrode Assembly For Delivering A Therapeutic Agent Into Ocular Tissue App 20110275981 - SINGH; RISHI P. ; et al. | 2011-11-10 |
| Electrically-conductive Foam Emi Shield App 20110162879 - Bunyan; Michael H. ; et al. | 2011-07-07 |
| Reactive foil assembly Grant 7,897,264 - Bunyan March 1, 2 | 2011-03-01 |
| Conformal thermal interface material for electronic components Grant RE41,576 - Bunyan , et al. August 24, 2 | 2010-08-24 |
| Thermal management materials having a phase change dispersion Grant 7,682,690 - Bunyan , et al. March 23, 2 | 2010-03-23 |
| Emi Absorbing Gap Filling Material App 20080012103 - Foster; Robert H. ; et al. | 2008-01-17 |
| Dispensable cured resin App 20070230131 - Bunyan; Michael H. ; et al. | 2007-10-04 |
| Reactive foil assembly App 20070224441 - Bunyan; Michael H. | 2007-09-27 |
| Thermally or electrically-conductive form-in-place gap filter Grant 7,208,192 - Bunyan , et al. April 24, 2 | 2007-04-24 |
| Form-in-place EMI gaskets App 20070052125 - Kalinoski; John P. ; et al. | 2007-03-08 |
| Lightweight heat sink Grant 7,147,041 - Mitchell , et al. December 12, 2 | 2006-12-12 |
| Polishing article for electro-chemical mechanical polishing Grant 7,141,155 - Bunyan , et al. November 28, 2 | 2006-11-28 |
| Thermal lamination module App 20060263570 - Bunyan; Michael H. | 2006-11-23 |
| Lightweight heat sink App 20050241801 - Mitchell, Jonathan E. ; et al. | 2005-11-03 |
| High temperature stable thermal interface material Grant 6,956,739 - Bunyan October 18, 2 | 2005-10-18 |
| Thermal management materials Grant 6,946,190 - Bunyan September 20, 2 | 2005-09-20 |
| Clean release, phase change thermal interface Grant 6,835,453 - Greenwood , et al. December 28, 2 | 2004-12-28 |
| Polishing article for electro-chemical mechanical polishing App 20040159558 - Bunyan, Michael H. ; et al. | 2004-08-19 |
| Flame retardant EMI shielding gasket Grant 6,777,095 - Bunyan , et al. August 17, 2 | 2004-08-17 |
| Flame retardant EMI shielding gasket App 20040142616 - Bunyan, Michael H. ; et al. | 2004-07-22 |
| High temperature stable thermal interface material App 20040081843 - Bunyan, Michael H. | 2004-04-29 |
| Flame retardant EMI shielding gasket Grant 6,716,536 - Bunyan , et al. April 6, 2 | 2004-04-06 |
| Thermally or electrically-conductive form-in-place gap filter App 20030222249 - Bunyan, Michael H. ; et al. | 2003-12-04 |
| Conformal thermal interface material for electronic components App 20030207064 - Bunyan, Michael H. ; et al. | 2003-11-06 |
| Form-in place EMI gaskets Grant 6,635,354 - Bunyan , et al. October 21, 2 | 2003-10-21 |
| Thermal management materials having a phase change dispersion App 20030152764 - Bunyan, Michael H. ; et al. | 2003-08-14 |
| Flame retardant EMI shielding gasket App 20030124934 - Bunyan, Michael H. ; et al. | 2003-07-03 |
| Flame retardant EMI shielding gasket Grant 6,521,348 - Bunyan , et al. February 18, 2 | 2003-02-18 |
| Clean release, phase change thermal interface App 20020135984 - Greenwood, Alfred W. ; et al. | 2002-09-26 |
| Flame retardant EMI shielding gasket App 20020125026 - Bunyan, Michael H. ; et al. | 2002-09-12 |
| Double-side thermally conductive adhesive tape for plastic-packaged electronic components Grant 6,432,497 - Bunyan August 13, 2 | 2002-08-13 |
| Intumescent, flame retardant pressure sensitive adhesive composition for EMI shielding applications Grant 6,410,137 - Bunyan June 25, 2 | 2002-06-25 |
| Form-in-place EMI gaskets App 20020076547 - Kalinoski, John P. ; et al. | 2002-06-20 |
| Form-in-place EMI gaskets App 20020039658 - Bunyan, Michael H. ; et al. | 2002-04-04 |
| Double-side Thermally Conductive Adhesive Tape For Plastic-packaged Electronic Components App 20020012762 - BUNYAN, MICHAEL H. | 2002-01-31 |
| Form-in-place EMI gaskets Grant 6,331,349 - Kalinoski , et al. December 18, 2 | 2001-12-18 |
| Flame retardant EMI shielding gasket App 20010031589 - Bunyan, Michael H. ; et al. | 2001-10-18 |
| Form-in-place EMI gaskets Grant 6,096,413 - Kalinoski , et al. August 1, 2 | 2000-08-01 |
| Apparatus for forming a gasket Grant 6,056,527 - Bunyan , et al. May 2, 2 | 2000-05-02 |
| Conformal thermal interface material for electronic components Grant 6,054,198 - Bunyan , et al. April 25, 2 | 2000-04-25 |
| Method for forming an EMI shielding gasket Grant 5,641,438 - Bunyan , et al. June 24, 1 | 1997-06-24 |
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