BUNT; Jay A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for BUNT; Jay A..The latest application filed is for "tamper-respondent assemblies with porous heat transfer element(s)".

Company Profile

1.7.10

BUNT; Jay A. - Esopus NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Tamper-respondent Assemblies With Porous Heat Transfer Element(s) App 20220192011 - ZHANG; Hongqing ; et al.	2022-06-16
High Power Device Fault Localization Via Die Surface Contouring App 20220155049 - Lewison; David J. ; et al.	2022-05-19
Tamper-respondent assembly with structural material within sealed inner compartment Grant 11,191,155 - Zhang , et al. November 30, 2	2021-11-30
Conformal integrated circuit (IC) device package lid Grant 11,158,562 - Lewison , et al. October 26, 2	2021-10-26
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover Grant 11,156,409 - Zhang , et al. October 26, 2	2021-10-26
Conformal Integrated Circuit (IC) Device Package Lid App 20210249333 - Lewison; David J. ; et al.	2021-08-12
Lid/heat Spreader Having Targeted Flexibility App 20210233825 - LI; SHIDONG ; et al.	2021-07-29
Coolant-cooled Heat Sinks With Internal Thermally-conductive Fins Joined To The Cover App 20210222956 - ZHANG; Hongqing ; et al.	2021-07-22
Non-destructive Bond Line Thickness Measurement Of Thermal Interface Material On Silicon Packages App 20210123729 - Zhang; Hongqing ; et al.	2021-04-29
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins Grant 10,842,043 - Zhang , et al. November 17, 2	2020-11-17
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers Grant 8,156,990 - Bunt , et al. April 17, 2	2012-04-17
Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers Grant 7,947,143 - Bunt , et al. May 24, 2	2011-05-24
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers Grant 7,836,935 - Bunt , et al. November 23, 2	2010-11-23
Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20080190565 - Bunt; Jay A. ; et al.	2008-08-14
Method For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20080190545 - Bunt; Jay A. ; et al.	2008-08-14
Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20080190566 - Bunt; Jay A. ; et al.	2008-08-14
Method And Apparatus For Providing Uniaxial Load Distribution For Laminate Layers Of Multilayer Ceramic Chip Carriers App 20070113950 - Bunt; Jay A. ; et al.	2007-05-24

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