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Patent applications and USPTO patent grants for Bundza; Nicholas Adam.The latest application filed is for "sealed expansion module".
Patent | Date |
---|---|
Sealed expansion module Grant 8,023,271 - Arlotta , et al. September 20, 2 | 2011-09-20 |
Multi-dwelling unit module for passive optical networks Grant 7,660,409 - Czerwiec , et al. February 9, 2 | 2010-02-09 |
Sealed expansion module App 20090101382 - Arlotta; Angelo ;   et al. | 2009-04-23 |
Electronics equipment cabinet Grant 7,312,993 - Bundza , et al. December 25, 2 | 2007-12-25 |
Ventilated housing and assembly App 20070264921 - Letourneau; Fabien ;   et al. | 2007-11-15 |
Electronics equipment cabinet App 20070144704 - Bundza; Nicholas Adam ;   et al. | 2007-06-28 |
Electrical cable connectors, electrical cable assemblies, and methods of making same App 20060292916 - Bundza; Nicholas Adam ;   et al. | 2006-12-28 |
EMI shield/ gasket enclosure Grant 6,137,051 - Bundza October 24, 2 | 2000-10-24 |
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