Bultitude; John
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bultitude; John.The latest application filed is for "resonant multilayer ceramic capacitors".
Company Profile
27.63.63
- Bultitude; John - Simpsonville SC
- Bultitude; John - Greenville SC US
- BULTITUDE; JOHN - MONROE CT
- Bultitude; John - Greensville SC
- Bultitude; John - Banbury GB
Patent Activity
| Patent | Date |
|---|---|
| Method of forming an electronic device Grant 11,432,448 - McConnell , et al. August 30, 2 | 2022-08-30 |
| Ceramic overvoltage protection device having low capacitance and improved durability Grant 11,393,635 - Kinnon , et al. July 19, 2 | 2022-07-19 |
| Ceramic overvoltage protection device having low capacitance and improved durability Grant 11,393,636 - Kinnon , et al. July 19, 2 | 2022-07-19 |
| Resonant Multilayer Ceramic Capacitors App 20220076892 - Bultitude; John ; et al. | 2022-03-10 |
| Leadless multi-layered ceramic capacitor stack Grant 11,227,719 - McConnell , et al. January 18, 2 | 2022-01-18 |
| Ceramic overvoltage protection device having low capacitance and improved durability Grant 11,178,800 - Jones , et al. November 16, 2 | 2021-11-16 |
| Multi-Terminal MLCC for Improved Heat Dissipation App 20210327646 - Laps; Mark R. ; et al. | 2021-10-21 |
| Structural Lead Frame App 20210241977 - Miller; Galen W. ; et al. | 2021-08-05 |
| ESD suppression using light emissions Grant 11,081,882 - Bultitude , et al. August 3, 2 | 2021-08-03 |
| Component Assemblies and Embedding for High Density Electronics App 20210227693 - Bultitude; John ; et al. | 2021-07-22 |
| Gate drive interposer with integrated passives for wide band gap semiconductor devices Grant 11,037,871 - Templeton , et al. June 15, 2 | 2021-06-15 |
| Electronic component structures with reduced microphonic noise Grant 10,984,955 - Bultitude , et al. April 20, 2 | 2021-04-20 |
| Packages for power modules with integrated passives Grant 10,950,688 - Bultitude , et al. March 16, 2 | 2021-03-16 |
| Multilayered ceramic capacitor structures for use at high power Grant 10,840,023 - Bultitude , et al. November 17, 2 | 2020-11-17 |
| Component Stability Structure App 20200323112 - McConnell; John E. ; et al. | 2020-10-08 |
| Method of forming a leadless stack comprising multiple components Grant 10,790,094 - McConnell , et al. September 29, 2 | 2020-09-29 |
| Packages for Power Modules with Integrated Passives App 20200273949 - Bultitude; John ; et al. | 2020-08-27 |
| Gate Drive Interposer with Integrated Passives for Wide Band Gap Semiconductor Devices App 20200273791 - Templeton; Allen ; et al. | 2020-08-27 |
| Higher density multi-component and serial packages Grant 10,757,811 - Burk , et al. A | 2020-08-25 |
| High density multi-component packages Grant 10,757,810 - Bultitude , et al. A | 2020-08-25 |
| Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability App 20200260618 - A1 | 2020-08-13 |
| Component stability structure Grant 10,729,051 - McConnell , et al. | 2020-07-28 |
| Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability App 20200219657 - Kinnon; Iain D. ; et al. | 2020-07-09 |
| High density multi-component packages Grant 10,707,145 - Bultitude , et al. | 2020-07-07 |
| High density multi-component packages Grant 10,681,814 - Bultitude , et al. | 2020-06-09 |
| Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability App 20200163260 - Jones; Lonnie G. ; et al. | 2020-05-21 |
| Ceramic Overvoltage Protection Device Having Low Capacitance and Improved Durability App 20200161058 - Kinnon; Iain D. ; et al. | 2020-05-21 |
| Multilayer ceramic structure Grant 10,622,157 - Bultitude | 2020-04-14 |
| Multilayer ceramic structure Grant 10,593,483 - Bultitude | 2020-03-17 |
| ESD Suppression Using Light Emissions App 20200028356 - Bultitude; John ; et al. | 2020-01-23 |
| Multilayer Ceramic Structure App 20190355523 - Bultitude; John | 2019-11-21 |
| Leadless Stack Comprising Multiple Components App 20190318877 - McConnell; John E. ; et al. | 2019-10-17 |
| Electronic Component Structures with Reduced Microphonic Noise App 20190304698 - Bultitude; John ; et al. | 2019-10-03 |
| Multilayer ceramic structure Grant 10,410,794 - Bultitude Sept | 2019-09-10 |
| Leadless stack comprising multiple components Grant 10,381,162 - McConnell , et al. A | 2019-08-13 |
| Electronic component structures with reduced microphonic noise Grant 10,366,836 - Bultitude , et al. July 30, 2 | 2019-07-30 |
| Higher Density Multi-Component and Serial Packages App 20190200457 - Burk; James A. ; et al. | 2019-06-27 |
| Multilayer Ceramic Structure App 20190157009 - Bultitude; John | 2019-05-23 |
| High Density Multi-Component Packages App 20190090348 - Bultitude; John ; et al. | 2019-03-21 |
| High Density Multi-Component Packages App 20190082539 - Bultitude; John ; et al. | 2019-03-14 |
| High Density Multi-Component Packages App 20190080982 - Bultitude; John ; et al. | 2019-03-14 |
| Bulk MLCC capacitor module Grant 10,224,149 - Miller , et al. | 2019-03-05 |
| Multilayered Ceramic Capacitor Structures for Use at High Power App 20190066927 - Bultitude; John ; et al. | 2019-02-28 |
| Higher density multi-component and serial packages Grant 10,178,770 - Burk , et al. J | 2019-01-08 |
| Stable Power Capacitors by Thermoelectric Cooling App 20180368293 - BULTITUDE; JOHN ; et al. | 2018-12-20 |
| Multilayer ceramic capacitor structures for use at high power Grant 10,147,544 - Bultitude , et al. De | 2018-12-04 |
| Multilayer Ceramic Capacitor Structures for Use at High Power App 20180337002 - Bultitude; John ; et al. | 2018-11-22 |
| Leadless multi-layered ceramic capacitor stacks Grant 10,068,707 - McConnell , et al. September 4, 2 | 2018-09-04 |
| Leadless Multi-Layered Ceramic Capacitor Stack App 20180190430 - McConnell; John E. ; et al. | 2018-07-05 |
| Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bonds Grant 9,881,744 - McConnell , et al. January 30, 2 | 2018-01-30 |
| Multilayer Ceramic Structure App 20180012706 - Bultitude; John | 2018-01-11 |
| Component Stability Structure App 20170367228 - McConnell; John E. ; et al. | 2017-12-21 |
| Leadless Stack Comprising Multiple Components App 20170358397 - McConnell; John E. ; et al. | 2017-12-14 |
| Multiple MLCC modules Grant 9,805,872 - Miller , et al. October 31, 2 | 2017-10-31 |
| Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond Grant 9,793,057 - McConnell , et al. October 17, 2 | 2017-10-17 |
| Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materials Grant 9,779,874 - McConnell , et al. October 3, 2 | 2017-10-03 |
| Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors Grant 9,748,043 - Chacko , et al. August 29, 2 | 2017-08-29 |
| Multiple MLCC Modules App 20170169955 - Miller; Galen W. ; et al. | 2017-06-15 |
| Bulk MLCC Capacitor Module App 20170169956 - Miller; Galen W. ; et al. | 2017-06-15 |
| Electronic Component Structures with Reduced Microphonic Noise App 20170025223 - Bultitude; John ; et al. | 2017-01-26 |
| Method of making a high capacitance multilayer capacitor with high voltage capability Grant 9,490,072 - Bultitude , et al. November 8, 2 | 2016-11-08 |
| Leadless multi-layered ceramic capacitor stacks Grant 9,472,342 - McConnell , et al. October 18, 2 | 2016-10-18 |
| Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metallurgical Bond App 20160254097 - McConnell; John E. ; et al. | 2016-09-01 |
| Coefficient of thermal expansion compensating compliant component Grant 9,357,634 - McConnell , et al. May 31, 2 | 2016-05-31 |
| Surface mountable multi-layer ceramic filter Grant 9,287,844 - Bultitude , et al. March 15, 2 | 2016-03-15 |
| Leadless Multi-Layered Ceramic Capacitor Stacks App 20160071650 - McConnell; John E. ; et al. | 2016-03-10 |
| Stacked leaded array Grant 9,171,672 - McConnell , et al. October 27, 2 | 2015-10-27 |
| Discharge capacitor Grant 9,142,353 - Bultitude , et al. September 22, 2 | 2015-09-22 |
| Asymmetric high voltage capacitor Grant 9,087,648 - Bultitude , et al. July 21, 2 | 2015-07-21 |
| Very large ceramic capacitor with mechanical shock resistance Grant 9,025,311 - Bultitude , et al. May 5, 2 | 2015-05-05 |
| Integrated EMI filter and surge protection component Grant 8,947,852 - Jones , et al. February 3, 2 | 2015-02-03 |
| Externally fused and resistively loaded safety capacitor Grant 8,904,609 - Bultitude , et al. December 9, 2 | 2014-12-09 |
| Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes Grant 8,902,565 - McConnell , et al. December 2, 2 | 2014-12-02 |
| Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitors Grant 8,896,986 - Chacko , et al. November 25, 2 | 2014-11-25 |
| High capacitance multilayer with high voltage capability Grant 8,885,319 - Bultitude , et al. November 11, 2 | 2014-11-11 |
| Overvoltage protection component Grant 8,885,324 - Bultitude , et al. November 11, 2 | 2014-11-11 |
| High Capacitance Multilayer with High Voltage Capability App 20140230210 - Bultitude; John ; et al. | 2014-08-21 |
| Discharge Capacitor App 20140232485 - Bultitude; John ; et al. | 2014-08-21 |
| Integrated EMI Filter and Surge Protection Component App 20140198422 - Jones; Lonnie G. ; et al. | 2014-07-17 |
| Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metalurgical Bonds App 20140177132 - MCCONNELL; JOHN E. ; et al. | 2014-06-26 |
| Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials App 20140139971 - McConnell; John E. ; et al. | 2014-05-22 |
| Leadless Multi-Layered Ceramic Capacitor Stacks App 20140002952 - McConnell; John E. ; et al. | 2014-01-02 |
| Method of Improving Electromechanical Integrity of Cathode Coating to Cathode Termination Interfaces in Solid Electrolytic Capacitors App 20130314845 - Chacko; Antony P. ; et al. | 2013-11-28 |
| Coefficient Of Thermal Expansion Compensating Compliant Component App 20130284501 - McConnell; John E. ; et al. | 2013-10-31 |
| Asymmetric High Voltage Capacitor App 20130250473 - Bultitude; John ; et al. | 2013-09-26 |
| Overvoltage Protection Component App 20130208395 - Bultitude; John ; et al. | 2013-08-15 |
| Stacked Leaded Array App 20130016488 - McConnell; John E. ; et al. | 2013-01-17 |
| Surface Mountable Multi-layer Ceramic Filter App 20130009727 - Bultitude; John ; et al. | 2013-01-10 |
| Sintering Of High Temperature Conductive And Resistive Pastes Onto Temperature Sensitive And Atmospheric Sensitive Materials App 20130010400 - McConnell; John E. ; et al. | 2013-01-10 |
| Leaded multi-layer ceramic capacitor with low ESL and low ESR Grant 8,331,078 - McConnell , et al. December 11, 2 | 2012-12-11 |
| High Voltage Capacitors App 20120297596 - BULTITUDE; JOHN ; et al. | 2012-11-29 |
| Bulk Capacitor And Method App 20120300363 - Katraro; Reuven ; et al. | 2012-11-29 |
| High Voltage Capacitors App 20120250219 - Bultitude; John ; et al. | 2012-10-04 |
| Externally fused and resistively loaded safety capacitor Grant 8,264,816 - Bultitude , et al. September 11, 2 | 2012-09-11 |
| Bulk capacitor and method Grant 8,238,076 - Katraro , et al. August 7, 2 | 2012-08-07 |
| High voltage capacitors Grant 8,238,075 - Bultitude , et al. August 7, 2 | 2012-08-07 |
| Externally Fused And Resistively Loaded Safety Capacitor App 20120079693 - Bultitude; John ; et al. | 2012-04-05 |
| High voltage capacitors Grant 8,125,762 - Bultitude , et al. February 28, 2 | 2012-02-28 |
| Method Of Improving Electromechanical Integrity Of Cathode Coating To Cathode Termination Interfaces In Solid Electrolytic Capacitors App 20110292572 - Chacko; Antony P. ; et al. | 2011-12-01 |
| Electronic Component Termination And Assembly By Means Of Transient Liquid Phase Sintering And Polymer Solder Pastes App 20110292567 - McConnell; John E. ; et al. | 2011-12-01 |
| Method of making a frame package array device Grant 8,028,397 - Bultitude October 4, 2 | 2011-10-04 |
| Externally Fused And Resistively Loaded Safety Capacitor App 20110043963 - Bultitude; John ; et al. | 2011-02-24 |
| High Capacitance Multilayer With High Voltage Capability App 20110002082 - Bultitude; John ; et al. | 2011-01-06 |
| Leaded Multi-layer Ceramic Capacitor With Low Esl And Low Esr App 20100243307 - McConnell; John E. ; et al. | 2010-09-30 |
| High voltage capacitors Grant 7,715,173 - Bultitude , et al. May 11, 2 | 2010-05-11 |
| Bulk Capacitor And Method App 20100073846 - Katraro; Reuven ; et al. | 2010-03-25 |
| High Voltage Capacitors App 20100033894 - BULTITUDE; JOHN ; et al. | 2010-02-11 |
| High Voltage Capacitors App 20090052111 - BULTITUDE; JOHN ; et al. | 2009-02-26 |
| High Voltage Capacitors App 20090052112 - BULTITUDE; JOHN ; et al. | 2009-02-26 |
| Frame Packaged Array Electronic Component App 20080189931 - BULTITUDE; JOHN | 2008-08-14 |
| High voltage capacitors Grant 7,336,475 - Bultitude , et al. February 26, 2 | 2008-02-26 |
| High voltage capacitors App 20070195484 - Bultitude; John ; et al. | 2007-08-23 |
| Frame packaged array electronic component App 20070096345 - Bultitude; John | 2007-05-03 |
| Ceramic dielectrics compositions Grant 5,550,092 - Chu , et al. August 27, 1 | 1996-08-27 |
| Lead perovskite based ceramic compositions without any free lead oxide Grant 5,461,014 - Chu , et al. October 24, 1 | 1995-10-24 |
| Sintering aid Grant 5,262,368 - Hood , et al. November 16, 1 | 1993-11-16 |
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