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Patent applications and USPTO patent grants for BULLEMA; Jan Eite.The latest application filed is for "evaporative microchip cooling".
Patent | Date |
---|---|
Evaporative Microchip Cooling App 20220028754 - BULLEMA; Jan Eite ;   et al. | 2022-01-27 |
Electrode For Use In A Layered Device Structure, As Well As A Battery Device App 20210159560 - BULLEMA; Jan Eite ;   et al. | 2021-05-27 |
Active Carrier For Carrying A Wafer And Method For Release App 20130323907 - Oosterhuis; Gerrit ;   et al. | 2013-12-05 |
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