Budinger, William D.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Budinger, William D..The latest application filed is for "polymeric polishing pad having continuously regenerated work surface".

Company Profile

0.25.7

Budinger, William D. - Newark DE
Budinger; William D. - Key West FL
Budinger, William D. - Wilmington DE
Budinger; William D. - Kennett Square PA
Budinger; William D. - Chadds Ford PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polymeric polishing pad having continuously regenerated work surface App 20050221741 - Reinhardt, Heinz F. ; et al.	2005-10-06
Method of polishing a semiconductor device Grant 6,903,021 - Reinhardt , et al. June 7, 2	2005-06-07
Polishing pad for a semiconductor device having a dissolvable substance Grant 6,899,611 - Reinhardt , et al. May 31, 2	2005-05-31
Window portion with an adjusted rate of wear Grant 6,860,793 - Budinger , et al. March 1, 2	2005-03-01
Method of polishing a semiconductor device App 20040224142 - Reinhardt, Heinz F. ; et al.	2004-11-11
Polymeric polishing pad having continuously regenerated work surface App 20030068960 - Reinhardt, Heinz F. ; et al.	2003-04-10
Polishing pad with a transparent portion Grant 6,517,417 - Budinger , et al. February 11, 2	2003-02-11
Method relating to a polishing system having a multi-phase polishing layer Grant 6,488,570 - James , et al. December 3, 2	2002-12-03
Polymeric polishing pad having continuously regenerated work surface Grant 6,439,989 - Reinhardt , et al. August 27, 2	2002-08-27
Apparatus and methods for chemical-mechanical polishing of semiconductor wafers App 20020020495 - James, David B. ; et al.	2002-02-21
Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like Grant 6,337,281 - James , et al. January 8, 2	2002-01-08
Window portion with an adjusted rate of wear App 20010053658 - Budinger, William D. ; et al.	2001-12-20
System for ordering and manufacturing a tangible device App 20010032111 - Jensen, Elmer W. JR. ; et al.	2001-10-18
Polishing pad with a transparent portion App 20010031610 - Budinger, William D. ; et al.	2001-10-18
Apparatus and methods for chemical-mechanical polishing of semiconductor wafers Grant 6,245,679 - Cook , et al. June 12, 2	2001-06-12
Apparatus and methods for chemical-mechanical polishing of semiconductor wafers Grant 6,210,525 - James , et al. April 3, 2	2001-04-03
Method of manufacturing a polymeric polishing pad having photolithographically induced surface pattern(s) Grant 6,210,254 - Cook , et al. April 3, 2	2001-04-03
Polishing system having a multi-phase polishing substrate and methods relating thereto Grant 6,099,394 - James , et al. August 8, 2	2000-08-08
Polishing slurry compositions capable of providing multi-modal particle packing and methods relating thereto Grant 6,093,649 - Roberts , et al. July 25, 2	2000-07-25
Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like Grant 6,069,080 - James , et al. May 30, 2	2000-05-30
Polymeric polishing pad having photolithographically induced surface patterns(s) and methods relating thereto Grant 6,036,579 - Cook , et al. March 14, 2	2000-03-14
Polishing pad and methods relating thereto Grant 6,022,264 - Cook , et al. February 8, 2	2000-02-08
Apparatus and methods for recirculating chemical-mechanical polishing of semiconductor wafers Grant 5,932,486 - Cook , et al. August 3, 1	1999-08-03
Method for planarizing a semiconductor device surface with polymeric pad containing hollow polymeric microelements Grant 5,900,164 - Budinger , et al. May 4, 1	1999-05-04
Method and apparatus for determination and display of critical gas supply information Grant 5,016,483 - Budinger May 21, 1	1991-05-21
Method and apparatus for determination and display of gas consumption time Grant 4,970,897 - Budinger November 20, 1	1990-11-20
Method and apparatus for determination and display of critical gas supply information Grant 4,926,703 - Budinger May 22, 1	1990-05-22
Pad material for grinding, lapping and polishing Grant 4,927,432 - Budinger , et al. May 22, 1	1990-05-22
Method and apparatus for determination and display of critical gas supply information Grant 4,876,903 - Budinger October 31, 1	1989-10-31
Workpiece holder for polishing operation Grant 4,512,113 - Budinger April 23, 1	1985-04-23
Nip Pressure Measurement Grant 3,760,637 - Budinger , et al. September 25, 1	1973-09-25
Roller For Printing Press Grant 3,635,158 - Budinger January 18, 1	1972-01-18

Company Registrations

SEC

0001497089

Budinger William D

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