Buckalew; Bryan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Buckalew; Bryan.The latest application filed is for "flow assisted dynamic seal for high-convection, continuous-rotation plating".

Company Profile

7.13.12

Buckalew; Bryan - Tualatin OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Copper electrodeposition sequence for the filling of cobalt lined features Grant 10,930,511 - Velmurugan , et al. February 23, 2	2021-02-23
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating App 20200232114 - Berke; Aaron ; et al.	2020-07-23
Flow assisted dynamic seal for high-convection, continuous-rotation plating Grant 10,612,151 - Berke , et al.	2020-04-07
System And Method For Chemical And Heated Wetting Of Substrates Prior To Metal Plating App 20200035484 - OBERST; Justin ; et al.	2020-01-30
Copper Electrodeposition On Cobalt Lined Features App 20190301040 - Velmurugan; Jeyavel ; et al.	2019-10-03
Copper Electrodeposition Sequence For The Filling Of Cobalt Lined Features App 20190304789 - Velmurugan; Jeyavel ; et al.	2019-10-03
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating App 20190264347 - Berke; Aaron ; et al.	2019-08-29
Wide Lipseal For Electroplating App 20180251907 - Thorkelsson; Kari ; et al.	2018-09-06
Control of electrolyte composition in a copper electroplating apparatus Grant 9,045,841 - Buckalew , et al. June 2, 2	2015-06-02
Rapidly cleanable electroplating cup seal Grant 8,398,831 - Ghongadi , et al. March 19, 2	2013-03-19
Electroplating cup assembly Grant 8,377,268 - Rash , et al. February 19, 2	2013-02-19
Method and apparatus for electroplating Grant 8,308,931 - Reid , et al. November 13, 2	2012-11-13
Control of electrolyte composition in a copper electroplating apparatus Grant 8,128,791 - Buckalew , et al. March 6, 2	2012-03-06
Electroplating Cup Assembly App 20110233056 - Rash; Robert ; et al.	2011-09-29
Rapidly Cleanable Electroplating Cup Seal App 20110181000 - Ghongadi; Shantinath ; et al.	2011-07-28
Closed contact electroplating cup assembly Grant 7,985,325 - Rash , et al. July 26, 2	2011-07-26
Rapidly cleanable electroplating cup assembly Grant 7,935,231 - Ghongadi , et al. May 3, 2	2011-05-03
Method and apparatus for electroplating including remotely positioned second cathode Grant 7,854,828 - Reid , et al. December 21, 2	2010-12-21
Method and apparatus for electroplating App 20100032310 - Reid; Jonathan ; et al.	2010-02-11
Method and apparatus for electroplating including remotely positioned second cathode App 20100032303 - Reid; Jonathan ; et al.	2010-02-11
Rapidly Cleanable Electroplating Cup Assembly App 20090107835 - Ghongadi; Shantinath ; et al.	2009-04-30
Closed Contact Electroplating Cup Assembly App 20090107836 - Rash; Robert ; et al.	2009-04-30

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