Buchwalter; Stephen Leslie

Patent Applications and Registrations

Patent applications and USPTO patent grants for Buchwalter; Stephen Leslie.The latest application filed is for "electrical interconnect structure".

Company Profile

0.17.10

Buchwalter; Stephen Leslie - Hopewell Junction NY
Buchwalter; Stephen Leslie - Wappingers Falls NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electrical interconnect forming method Grant 8,541,299 - Buchwalter , et al. September 24, 2	2013-09-24
Electrical interconnect structure Grant 8,476,773 - Buchwalter , et al. July 2, 2	2013-07-02
Electrical interconnect forming method Grant 8,242,010 - Buchwalter , et al. August 14, 2	2012-08-14
Electrical Interconnect Forming Method App 20100230475 - Buchwalter; Stephen Leslie ; et al.	2010-09-16
Electrical Interconnect Structure App 20100230143 - Buchwalter; Stephen Leslie ; et al.	2010-09-16
Electrical Interconnect Forming Method App 20100230474 - Buchwalter; Stephen Leslie ; et al.	2010-09-16
Electrical interconnect structure and method Grant 7,786,001 - Buchwalter , et al. August 31, 2	2010-08-31
Underfilling with acid-cleavable acetal and ketal epoxy oligomers Grant 7,776,993 - Buchwalter , et al. August 17, 2	2010-08-17
Electrical Interconnect Forming Method App 20090065555 - Buchwalter; Stephen Leslie ; et al.	2009-03-12
Electrical Interconnect Structure And Method App 20080251281 - Buchwalter; Stephen Leslie ; et al.	2008-10-16
Cap attach surface modification for improved adhesion Grant 7,064,013 - Buchwalter , et al. June 20, 2	2006-06-20
Reworkable b-stageable adhesive and use in waferlevel underfill App 20050250248 - Buchwalter, Stephen Leslie ; et al.	2005-11-10
Chip packaging module with active cooling mechanisms App 20050168947 - Mok, Lawrence Shungwei ; et al.	2005-08-04
Acid-cleavable acetal and ketal based epoxy oligomers Grant 6,919,420 - Buchwalter , et al. July 19, 2	2005-07-19
Cap attach surface modification for improved adhesion App 20040238967 - Buchwalter, Stephen Leslie ; et al.	2004-12-02
Cap attach surface modification for improved adhesion Grant 6,803,256 - Buchwalter , et al. October 12, 2	2004-10-12
Reworkable b-stageable adhesive and use in waferlevel underfill App 20040110010 - Buchwalter, Stephen Leslie ; et al.	2004-06-10
Cap attach surface modification for improved adhesion App 20020121698 - Buchwalter, Stephen Leslie ; et al.	2002-09-05
Cleavable acetal-containing diepoxide and anhydride curing agent for removable epoxy compositions Grant 6,258,899 - Buchwalter , et al. July 10, 2	2001-07-10
Reworkable thermoplastic encapsulant Grant 6,111,323 - Carter , et al. August 29, 2	2000-08-29
Reworkable polymer chip encapsulant Grant 5,930,597 - Call , et al. July 27, 1	1999-07-27
Strippable photoimageable compositions Grant 5,879,859 - Buchwalter , et al. March 9, 1	1999-03-09
Gel for localized removal of reworkable encapsulant Grant 5,858,943 - Buchwalter , et al. January 12, 1	1999-01-12
Multi-level circuit card structure Grant 5,786,986 - Bregman , et al. July 28, 1	1998-07-28
Reworkable polymer chip encapsulant Grant 5,659,203 - Call , et al. August 19, 1	1997-08-19

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