Buchwalter; Stephen L.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Buchwalter; Stephen L..The latest application filed is for "ultrasonic-assisted solder transfer".

Company Profile

2.46.31

Buchwalter; Stephen L. - Anthem AZ
Buchwalter; Stephen L. - Hopewell Junction NY
Buchwalter; Stephen L. - Armonk NY
Buchwalter; Stephen L - Hopewell Junction NY
Buchwalter; Stephen L. - Wappingers Falls NY
Buchwalter; Stephen L. - Allison Park PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Combination polyimide decal with a rigid mold Grant 11,270,966 - Nah , et al. March 8, 2	2022-03-08
Continuous solder transfer to substrates Grant 11,110,534 - Nah , et al. September 7, 2	2021-09-07
Ultrasonic-assisted Solder Transfer App 20210229203 - Nah; Jae-Woong ; et al.	2021-07-29
Combination Polyimide Decal With A Rigid Mold App 20210151402 - Nah; Jae-Woong ; et al.	2021-05-20
Continuous Solder Transfer To Substrates App 20200316702 - Nah; Jae-Woong ; et al.	2020-10-08
Process for making stubless printed circuit boards Grant 8,963,020 - Buchwalter , et al. February 24, 2	2015-02-24
Process For Making Stubless Printed Circuit Boards App 20130223030 - Buchwalter; Stephen L. ; et al.	2013-08-29
Process for making stubless printed circuit boards Grant 8,404,981 - Buchwalter , et al. March 26, 2	2013-03-26
Micro-fluidic injection molded solder (IMS) Grant 8,376,207 - Buchwalter , et al. February 19, 2	2013-02-19
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Grant 8,314,500 - Belanger , et al. November 20, 2	2012-11-20
Sprocket opening alignment process and apparatus for multilayer solder decal Grant 8,268,719 - Buchwalter , et al. September 18, 2	2012-09-18
Reworkable electronic device assembly and method Grant 8,227,264 - Andry , et al. July 24, 2	2012-07-24
Micro-Fluidic Injection Molded Solder (IMS) App 20120132694 - Buchwalter; Stephen L. ; et al.	2012-05-31
Micro-fluidic injection molded solder (IMS) Grant 8,162,200 - Buchwalter , et al. April 24, 2	2012-04-24
Micro-fluidic injection molded solder (IMS) Grant 8,136,714 - Buchwalter , et al. March 20, 2	2012-03-20
Micro-Fluidic Injection Molded Solder (IMS) App 20110233262 - Buchwalter; Stephen L. ; et al.	2011-09-29
Micro-Fluidic Injection Molded Solder (IMS) App 20110192887 - Buchwalter; Stephen L. ; et al.	2011-08-11
Micro-fluidic injection molded solder (IMS) Grant 7,980,446 - Buchwalter , et al. July 19, 2	2011-07-19
Reworkable Electronic Device Assembly And Method App 20110171756 - ANDRY; Paul S. ; et al.	2011-07-14
Reworkable electronic device assembly and method Grant 7,936,060 - Andry , et al. May 3, 2	2011-05-03
Sprocket Opening Alignment Process and Apparatus for Multilayer Solder Decal App 20110097892 - Buchwalter; Stephen L. ; et al.	2011-04-28
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Grant 7,932,169 - Belanger , et al. April 26, 2	2011-04-26
Sprocket opening alignment process and apparatus for multilayer solder decal Grant 7,928,585 - Buchwalter , et al. April 19, 2	2011-04-19
Semiconductor structure with solder bumps Grant 7,838,954 - Buchwalter , et al. November 23, 2	2010-11-23
Reworkable Electronic Device Assembly And Method App 20100276796 - ANDRY; Paul S. ; et al.	2010-11-04
Centrifugal method for filing high aspect ratio blind mirco vias powdered materials for circuit formation Grant 7,815,968 - Hougham , et al. October 19, 2	2010-10-19
Micro-fluidic Injection Molded Solder (ims) App 20100224670 - Buchwalter; Stephen L. ; et al.	2010-09-09
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers App 20100062597 - Belanger; Luc ; et al.	2010-03-11
Assembly Method For Reworkable Chip Stacking With Conductive Film App 20090181476 - Buchwalter; Stephen L. ; et al.	2009-07-16
Method Of Fabricating Solder Bumps App 20090181223 - Buchwalter; Stephen L. ; et al.	2009-07-16
Solder interconnect structure and method using injection molded solder Grant 7,523,852 - Buchwalter , et al. April 28, 2	2009-04-28
Method of producing coaxial solder bump connections using injection molding of solder Grant 7,516,879 - Buchwalter , et al. April 14, 2	2009-04-14
Sprocket Opening Alignment Process And Apparatus For Multilayer Solder Decal App 20090093111 - Buchwalter; Stephen L. ; et al.	2009-04-09
Centrifugal Method For Filing High Aspect Ratio Blind Micro Vias With Powdered Materials For Circuit Formation App 20090032962 - Hougham; Gareth ; et al.	2009-02-05
Injection Molded Microoptics App 20080285136 - Jacobowitz; Lawrence ; et al.	2008-11-20
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation Grant 7,452,568 - Hougham , et al. November 18, 2	2008-11-18
Process For Making Stubless Printed Circuit Boards App 20080277154 - Buchwalter; Stephen L. ; et al.	2008-11-13
Manufacture of printed circuit boards with stubless plated through-holes Grant 7,404,251 - Buchwalter , et al. July 29, 2	2008-07-29
Injection molded microoptics Grant 7,399,421 - Jacobowitz , et al. July 15, 2	2008-07-15
Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers App 20080157395 - Belanger; Luc ; et al.	2008-07-03
Manufacture of printed circuit boards with stubless plated through-holes App 20070246252 - Buchwalter; Stephen L. ; et al.	2007-10-25
Injection molded microoptics App 20070029277 - Jacobowitz; Lawrence ; et al.	2007-02-08
Composite solder transfer moldplate structure and method of making same App 20060289607 - Buchwalter; Stephen L. ; et al.	2006-12-28
Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation App 20060177568 - Hougham; Gareth ; et al.	2006-08-10
Solder interconnect structure and method using injection molded solder App 20060118604 - Buchwalter; Stephen L. ; et al.	2006-06-08
Injection molded continuously solidified solder method and apparatus App 20050263571 - Belanger, Luc ; et al.	2005-12-01
Bilayer wafer-level underfill Grant 6,924,171 - Buchwalter , et al. August 2, 2	2005-08-02
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays Grant 6,890,599 - Buchwalter , et al. May 10, 2	2005-05-10
Display fabrication using modular active devices Grant 6,879,098 - Buchwalter , et al. April 12, 2	2005-04-12
Display fabrication using modular active devices App 20040140763 - Buchwalter, Stephen L. ; et al.	2004-07-22
Reworkable and thermally conductive adhesive and use thereof App 20040041280 - Buchwalter, Stephen L. ; et al.	2004-03-04
Display fabrication using modular active devices Grant 6,698,077 - Buchwalter , et al. March 2, 2	2004-03-02
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays App 20030211341 - Buchwalter, Stephen L. ; et al.	2003-11-13
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays Grant 6,632,536 - Buchwalter , et al. October 14, 2	2003-10-14
Bilayer wafer-level underfill App 20020109228 - Buchwalter, Stephen L. ; et al.	2002-08-15
Self-assembled monolayer etch barrier for indium-tin-oxide useful in manufacturing thin film transistor-liquid crystal displays App 20020084252 - Buchwalter, Stephen L. ; et al.	2002-07-04
Display fabrication using modular active devices App 20020078559 - Buchwalter, Stephen L. ; et al.	2002-06-27
Precision alignment of plates Grant 6,104,466 - Buchwalter , et al. August 15, 2	2000-08-15
Method and solution for cleaning solder connections of electronic components Grant 5,759,285 - Buchwalter , et al. June 2, 1	1998-06-02
Cleavable diepoxide for removable epoxy compositions Grant 5,560,934 - Afzali-Ardakani , et al. October 1, 1	1996-10-01
Cleavable diepoxide for removable epoxy compositions Grant 5,512,613 - Afzali-Ardakani , et al. April 30, 1	1996-04-30
Method for bonding two surfaces together Grant 5,462,628 - Viehbeck , et al. October 31, 1	1995-10-31
Reactive surface functionalization Grant 5,357,005 - Buchwalter , et al. * October 18, 1	1994-10-18
Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes Grant 5,281,447 - Brady , et al. January 25, 1	1994-01-25
Method for conditioning an organic polymeric material Grant 5,242,713 - Viehbeck , et al. September 7, 1	1993-09-07
Method for etching an organic polymeric material Grant 5,203,955 - Viehbeck , et al. April 20, 1	1993-04-20
Isoimide modifications of a polyimide and reaction thereof with nucleophiles Grant 5,187,241 - Buchwalter , et al. February 16, 1	1993-02-16
Charge transfer salts and uses thereof Grant 5,179,467 - Buchwalter , et al. January 12, 1	1993-01-12
Method for conditioning an organic polymeric material Grant 5,135,779 - Viehbeck , et al. August 4, 1	1992-08-04
Surface midification of a polyimide Grant 5,133,840 - Buchwalter , et al. July 28, 1	1992-07-28
Polyimides reaction products and use in electrophoretic deposition Grant 4,832,808 - Buchwalter May 23, 1	1989-05-23
Self-curable resinous compositions useful in coating applications Grant 4,414,068 - Patricca , et al. November 8, 1	1983-11-08
Novel acrylic polymers and the Michael adducts thereof useful in coating applications Grant 4,330,640 - Buchwalter May 18, 1	1982-05-18
Resinous coating compositions curable by Michael adduct exchange Grant 4,198,331 - Buchwalter , et al. April 15, 1	1980-04-15
Cationic electrodeposition using aqueous dispersions of quaternary ammonium carbonate-containing polymers Grant 4,102,863 - Buchwalter , et al. July 25, 1	1978-07-25