Buch; Chintan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Buch; Chintan.The latest application filed is for "methods of forming microvias with reduced diameter".
- Buch; Chintan - Santa Clara CA
- Buch; Chintan - Austin TX
- Buch; Chintan - Sunnyvale CA
| Patent | Date |
|---|---|
| Fluoropolymer stamp fabrication method Grant 11,454,884 - Gouk , et al. September 27, 2 | 2022-09-27 |
| Methods Of Forming Microvias With Reduced Diameter App 20220246558 - Buch; Chintan ; et al. | 2022-08-04 |
| Methods for improved polymer-copper adhesion Grant 11,388,822 - Chakraborty , et al. July 12, 2 | 2022-07-12 |
| Method For Via Formation By Micro-imprinting App 20220171281 - GOUK; Roman ; et al. | 2022-06-02 |
| Package Structures With Built-in Emi Shielding App 20220157740 - VERHAVERBEKE; Steven ; et al. | 2022-05-19 |
| Methods of forming microvias with reduced diameter Grant 11,315,890 - Buch , et al. April 26, 2 | 2022-04-26 |
| Method for via formation by micro-imprinting Grant 11,281,094 - Gouk , et al. March 22, 2 | 2022-03-22 |
| Methods for Improved Polymer-Copper Adhesion App 20220071023 - Chakraborty; Tapash ; et al. | 2022-03-03 |
| Methods Of Forming Microvias With Reduced Diameter App 20220051999 - Buch; Chintan ; et al. | 2022-02-17 |
| Fluoropolymer Stamp Fabrication Method App 20210325776 - GOUK; Roman ; et al. | 2021-10-21 |
| Package Core Assembly And Fabrication Methods App 20210257289 - CHEN; Han-Wen ; et al. | 2021-08-19 |
| Package Core Assembly And Fabrication Methods App 20210249345 - CHEN; Han-Wen ; et al. | 2021-08-12 |
| Package Core Assembly And Fabrication Methods App 20210159160 - CHEN; Han-Wen ; et al. | 2021-05-27 |
| Package Core Assembly And Fabrication Methods App 20210159158 - CHEN; Han-Wen ; et al. | 2021-05-27 |
| Package structure with embedded core Grant 10,937,726 - Chen , et al. March 2, 2 | 2021-03-02 |
| Planarization Methods For Packaging Substrates App 20200391343 - CHEN; Han-Wen ; et al. | 2020-12-17 |
| Method for via formation in flowable epoxy materials by micro-imprint Grant 10,727,083 - Gouk , et al. | 2020-07-28 |
| Method For Via Formation By Micro-imprinting App 20200159113 - GOUK; Roman ; et al. | 2020-05-21 |
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