Bubber; Randhir S.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bubber; Randhir S..The latest application filed is for "atomic layer deposition for fabricating thin films".

Company Profile

0.7.3

Bubber; Randhir S. - San Ramon CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Atomic layer deposition for fabricating thin films Grant 7,037,574 - Paranjpe , et al. May 2, 2	2006-05-02
Method for fabricating a semiconductor chip interconnect Grant 6,812,126 - Paranjpe , et al. November 2, 2	2004-11-02
Microelectronic interconnect material with adhesion promotion layer and fabrication method Grant 6,645,847 - Paranjpe , et al. November 11, 2	2003-11-11
Microelectronic interconnect material with adhesion promotion layer and fabrication method Grant 6,627,995 - Paranjpe , et al. September 30, 2	2003-09-30
Atomic layer deposition for fabricating thin films App 20030003635 - Paranjpe, Ajit P. ; et al.	2003-01-02
Microelectronic interconnect material with adhesion promotion layer and fabrication method App 20020137332 - Paranjpe, Ajit P. ; et al.	2002-09-26
Method of chemical-vapor deposition of a material Grant 6,444,263 - Paranjpe , et al. September 3, 2	2002-09-03
Microelectronic interconnect material with adhesion promotion layer and fabrication method App 20020102838 - Paranjpe, Ajit P. ; et al.	2002-08-01
Microelectronic interconnect material with adhesion promotion layer and fabrication method Grant 6,365,502 - Paranjpe , et al. April 2, 2	2002-04-02
Semiconductor chip interconnect barrier material and fabrication method Grant 6,294,836 - Paranjpe , et al. September 25, 2	2001-09-25

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