Bub; Heiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bub; Heiko.The latest application filed is for "cable package".
- Bub; Heiko - Erzhausen DE
- Bub; Heiko - Bodenheim DE
| Patent | Date |
|---|---|
| Cable Package App 20100270191 - Bub; Heiko ; et al. | 2010-10-28 |
| Pack for flowable contents, a method for manufacturing - a pack of this kind, and a device for carrying out the method Grant 5,477,974 - Reil , et al. December 26, 1 | 1995-12-26 |
| Apparatus for forming the neck region on a plastics half shell Grant 5,425,627 - Reil , et al. June 20, 1 | 1995-06-20 |
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