Bu; Xiaomei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bu; Xiaomei.The latest application filed is for "reliable interconnect for semiconductor device".

Company Profile

0.8.7

Bu; Xiaomei - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reliable interconnect for semiconductor device Grant 9,054,107 - Zhang , et al. June 9, 2	2015-06-09
Reliable Interconnect For Semiconductor Device App 20140084486 - ZHANG; Fan ; et al.	2014-03-27
Reliable interconnect for semiconductor device Grant 8,598,031 - Zhang , et al. December 3, 2	2013-12-03
Grain boundary blocking for stress migration and electromigration improvement in CU interconnects Grant 7,989,338 - Zhang , et al. August 2, 2	2011-08-02
Reliable Interconnect For Semiconductor Device App 20110074039 - ZHANG; Fan ; et al.	2011-03-31
Combined copper plating method to improve gap fill Grant 7,585,768 - Bu , et al. September 8, 2	2009-09-08
Combined copper plating method to improve gap fill App 20070293039 - Bu; Xiaomei ; et al.	2007-12-20
Integrated circuit with protective moat Grant 7,224,060 - Zhang , et al. May 29, 2	2007-05-29
Grain boundary blocking for stress migration and electromigration improvement in CU interconnects App 20060286797 - Zhang; Fan ; et al.	2006-12-21
Structure and method of liner air gap formation Grant 7,094,669 - Bu , et al. August 22, 2	2006-08-22
Structure and method of liner air gap formation App 20060030128 - Bu; Xiaomei ; et al.	2006-02-09
Integrated circuit with protective moat App 20050167824 - Zhang, Fan ; et al.	2005-08-04
Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects Grant 6,913,994 - Guo , et al. July 5, 2	2005-07-05
Method to form Cu/OSG dual damascene structure for high performance and reliable interconnects App 20040203223 - Guo, Qiang ; et al.	2004-10-14

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.